Timothy Miller
Applied Materials
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Publication
Featured researches published by Timothy Miller.
2014 20th International Conference on Ion Implantation Technology (IIT) | 2014
Ying Tang; Oleg Byl; Anthony M. Avila; Joseph D. Sweeney; Richard S. Ray; John Koo; Min-Sung Jeon; Timothy Miller; Stephen Krause; Wesley Skinner; James Mullin
Ion implantation is known for its precise control and reproducibility of doping, enabling it to become one of the main approaches for high-efficiency cell manufacturing in the solar industry. Among the dopant materials, boron doping often represents the largest challenge to productivity as the efficiency of the traditional doping material, boron trifluoride (BF3), is always low. This paper presents a high-efficiency and high-productivity solution for boron doping on an Applied Materials solar ion implanter by using diboron tetrafluoride (B2F4) as a replacement gaseous boron source material for BF3. Both the B+ beam current and source life effects were evaluated. With optimized source parameters and beam tuning, the solar implanter with B2F4 has demonstrated significant improvements for both B+ beam current performance and source lifetime.
Review of Scientific Instruments | 2014
John Koo; Brant Binns; Timothy Miller; Stephen Krause; Wesley Skinner; James Mullin
In this paper, we introduce the Solion ion source for high-throughput solar cell doping. As the source power is increased to enable higher throughput, negative effects degrade the lifetime of the plasma chamber and the extraction electrodes. In order to improve efficiency, we have explored a wide range of electron energies and determined the conditions which best suit production. To extend the lifetime of the source we have developed an in situ cleaning method using only existing hardware. With these combinations, source life-times of >200 h for phosphorous and >100 h for boron ion beams have been achieved while maintaining 1100 cell-per-hour production.
international workshop on junction technology | 2017
Cuiyang Wang; Jonathan Gerald England; Hans Gossmann; Harold M. Persing; Timothy Miller; Qi Gao; Shan Tang; Siamak Salimian
In this paper the primary mechanisms for the plasma doping (PLAD) of 3D structures — direct implant, scattered implant, deposition & knock-in, and sputtering (etching) — are discussed. The TRI3DYN code was used to elucidate the roles these various doping mechanisms play. Through-fin SIMS profiles for an arsenic plasma doping process were calculated from the model and compared to experimental results. Further, by adjusting the competition and balance among these different doping mechanisms, we also demonstrate that the doping profile can be tuned on 3D fin structures for a boron plasma doping process.
Archive | 2004
Vikram Singh; Timothy Miller; Paul J. Murphy; Harold M. Persing; Jay T. Scheuer; Donna L. Smatlak; Edmund J. Winder; Robert H. Bettencourt
Archive | 2010
Timothy Miller; Vikram Singh; Ludovic Godet; Christopher J. Leavitt
Archive | 2007
Bon-Woong Koo; Steven R. Walther; Christopher J. Leavitt; Justin Tocco; Sung-Hwan Hyun; Timothy Miller; Jay T. Scheuer; Atul Gupta; Vikram Singh; Deven Raj
Archive | 2017
Vikram M. Bhosle; Timothy Miller; Charles T. Carlson; Bon-Woong Koo
Archive | 2013
Piotr R. Lubicki; Christopher J. Leavitt; Timothy Miller; Bon-Woong Koo
Bulletin of the American Physical Society | 2010
Svetlana Radovanov; Ludovic Godet; Timothy Miller; Nicholas Chamberlain; George D. Papasouliotis
Bulletin of the American Physical Society | 2009
John Koo; Ziwei Fang; Ludovic Godet; James Buff; Deven Raj; Timothy Miller