Ting-Hsiang Hung

Electrical properties of atomic layer deposited aluminum oxide on gallium nitride

We report on our investigation of the electrical properties of metal/Al2O3/GaN metal-insulator-semiconductor capacitors. We determined the conduction band offset and interface charge density of the alumina/GaN interface by analyzing the capacitance-voltage characteristics of atomic layer deposited Al2O3 films on GaN substrates. The conduction band offset at the Al2O3/GaN interface was calculated to be 2.13 eV, in agreement with theoretical predications. A non-zero field of 0.93 MV/cm in the oxide under flat-band conditions in the GaN was inferred, which we attribute to a fixed net positive charge density of magnitude 4.60 × 1012 cm−2 at the Al2O3/GaN interface. We provide hypotheses to explain the origin of this charge by analyzing the energy band line-up.

Interface charge engineering at atomic layer deposited dielectric/III-nitride interfaces

Interface charges at atomic layer deposited Al2O3/III-nitride interfaces were investigated for III-nitride layers of different polarity. A large positive sheet charge density is induced at the Al2O3/III-nitride interface on all the orientations of GaN and Ga-polar AlGaN, and this sheet charge can be significantly altered using post-metallization anneals. It is proposed that the charges are caused by interfacial defects that can be passivated and neutralized through a H2 based anneal. Tailoring of the interface charge density described here can be used to improve critical device characteristics such as gate leakage and electron transport, and for lateral electrostatic engineering.

Interface Charge Engineering for Enhancement-Mode GaN MISHEMTs

We demonstrate an efficient approach to engineer the dielectric/AlGaN positive interface fixed charges by oxygen plasma and post-metallization anneal. Significant suppression of interface fixed charges from 2 × 1013 to 8 × 1012 cm-2 was observed. Experimental and theoretical electron mobility characteristics and the impact of remote impurity scattering were investigated. The reduction in oxide/semiconductor interface charge density leads to an increase of electron mobility, and enables a positive threshold voltage.

Interfacial charge effects on electron transport in III-Nitride metal insulator semiconductor transistors

We report on the calculation of the two dimension electron gas (2DEG) mobility in scaled AlGaN/GaN metal-insulator-semiconductor high-electron-mobility-transistors. We investigate the effect of remote impurity and phonon scattering models on the 2DEG mobility of the dielectric/AlGaN/GaN structure and investigate its variation with dielectric/AlGaN interface charge density, 2DEG concentration, and AlGaN thickness. Remote impurity scattering was found to be the dominant mechanism when the 2DEG density is below 5 × 1012 cm−2 and dielectric/AlGaN interface charge density is above 5 × 1012 cm−2. The interfacial charge has significant effect on the mobility as the AlGaN cap layer thickness is scaled down below 5 nm.

Modeling of high composition AlGaN channel high electron mobility transistors with large threshold voltage

We report on the potential of high electron mobility transistors (HEMTs) consisting of high composition AlGaN channel and barrier layers for power switching applications. Detailed two-dimensional (2D) simulations show that threshold voltages in excess of 3 V can be achieved through the use of AlGaN channel layers. We also calculate the 2D electron gas mobility in AlGaN channel HEMTs and evaluate their power figures of merit as a function of device operating temperature and Al mole fraction in the channel. Our models show that power switching transistors with AlGaN channels would have comparable on-resistance to GaN-channel based transistors for the same operation voltage. The modeling in this paper shows the potential of high composition AlGaN as a channel material for future high threshold enhancement mode transistors.

Energy band line-up of atomic layer deposited Al2O3 on β-Ga2O3

Electrical properties of atomic layer deposited Al2O3/β-Ga2O3 interface were investigated. We determined the conduction band offset and interface charge density of Al2O3/β-Ga2O3 interface by analyzing the capacitance-voltage characteristics. The conduction band offset at the Al2O3/β-Ga2O3 interface was found to be 1.7 eV. A large positive sheet charge density of 3.6 × 1012 cm−2 is induced at the Al2O3/β-Ga2O3 interface, which caused a non-zero field of 0.7 MV/cm in the Al2O3 under flat-band conditions in the β-Ga2O3. The forward current-voltage characteristics were found to be related to trap-assisted tunneling.

Density-dependent electron transport and precise modeling of GaN high electron mobility transistors

We report on the direct measurement of two-dimensional sheet charge density dependence of electron transport in AlGaN/GaN high electron mobility transistors (HEMTs). Pulsed IV measurements established increasing electron velocities with decreasing sheet charge densities, resulting in saturation velocity of 1.9 × 107 cm/s at a low sheet charge density of 7.8 × 1011 cm−2. An optical phonon emission-based electron velocity model for GaN is also presented. It accommodates stimulated longitudinal optical (LO) phonon emission which clamps the electron velocity with strong electron-phonon interaction and long LO phonon lifetime in GaN. A comparison with the measured density-dependent saturation velocity shows that it captures the dependence rather well. Finally, the experimental result is applied in TCAD-based device simulator to predict DC and small signal characteristics of a reported GaN HEMT. Good agreement between the simulated and reported experimental results validated the measurement presented in this re...

A study of electrically active traps in AlGaN/GaN high electron mobility transistor

We have studied electron conduction mechanisms and the associated roles of the electrically active traps in the AlGaN layer of an AlGaN/GaN high electron mobility transistor structure. By fitting the temperature dependent I-V (Current-Voltage) curves to the Frenkel-Poole theory, we have identified two discrete trap energy levels. Multiple traces of I-V measurements and constant-current injection experiment all confirm that the main role of the traps in the AlGaN layer is to enhance the current flowing through the AlGaN barrier by trap-assisted electron conduction without causing electron trapping.

Electron tunneling spectroscopy study of electrically active traps in AlGaN/GaN high electron mobility transistors

We investigate the energy levels of electron traps in AlGaN/GaN high electron mobility transistors by the use of electron tunneling spectroscopy. Detailed analysis of a typical spectrum, obtained in a wide gate bias range and with both bias polarities, suggests the existence of electron traps both in the bulk of AlGaN and at the AlGaN/GaN interface. The energy levels of the electron traps have been determined to lie within a 0.5 eV band below the conduction band minimum of AlGaN, and there is strong evidence suggesting that these traps contribute to Frenkel-Poole conduction through the AlGaN barrier.

Determination of trap energy levels in AlGaN/GaN HEMT

The density of two dimensional electron gas (2DEG) in the channel of AlGaN/GaN HEMT is often altered by trapped charges on the surface or in the bulk of the heterostructure, limiting the device performance at high frequencies. The existing methods, such as photoionization spectroscopy, Deep Level Transient Spectroscopy (DLTS) etc., mainly focus on deep level traps in GaN, providing little information about traps in the AlGaN layer. In this work, we use Inelastic Electron Tunneling Spectroscopy (IETS), in conjunction with the Frenkel-Poole (F-P) trap energy extraction method developed by Yeh at el, to examine electrically active traps in the AlGaN barrier layer. The results indicate that traps exist in the AlGaN bulk, as well as at the AlGaN/GaN interface. The trap energy levels are within a 0.5eV band below the conduction band edge (Ec) of AlGaN in the sample that we studied.