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Tobias Bernhard

Atotech

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Publication

Featured researches published by Tobias Bernhard.

Thin Solid Films | 2014

Stress of electroless copper deposits on insulating and metal substrates

Ralf Brüning; Allison Sibley; Tanu Sharma; Delilah A. Brown; Thibault Demay; Frank Brüning; Tobias Bernhard

Microelectronic Engineering | 2015

Properties of electroless Cu films optimized for horizontal plating as a function of deposit thickness

Tanu Sharma; Ralf Brüning; Tang Cam Lai Nguyen; Tobias Bernhard; Frank Brüning

International Symposium on Microelectronics | 2015

A metal oxide adhesion layer prepared with water based coating solution for wet Cu metallization of glass interposer

Zhiming Liu; Sara Hunegnaw; Hailuo Fu; Jun Wang; Tafadzwa Magaya; Michael Merschky; Tobias Bernhard; Aric Shorey; Hobie Yun

International Symposium on Microelectronics | 2013

Analysis of stress/strain in Electroless Copper Films

Tobias Bernhard; Simon Bamberg; Frank Brüning; Ralf Brüning; Laurence J. Gregoriades; Tanu Sharma; Delilah A. Brown; M. Klaus; Ch. Genzel

Thin Solid Films | 2017

The effect of Ni on the kinetics of electroless Cu film deposition

Eric Logan; Tanu Sharma; Frank Brüning; Sebastian Zarwell; Edith Steinhäuser; Tobias Bernhard; Ning Chen; Ralf Brüning

Journal of microelectronics and electronic packaging | 2015

The Impact of Hydrogen Gas Evolution on Blister Formation in Electroless Cu Films

Tobias Bernhard; Frank Brüning; Ralf Brüning; Tanu Sharma; Delilah A. Brown; Sebastian Zarwell; Craig Bishop

International Symposium on Microelectronics | 2015

Main Impact Factors on Internal Stress of Electroless Deposited Copper Films

Tobias Bernhard; Sebastian Zarwell; Frank Brüning; Ralf Brüning; Tanu Sharma

electronic components and technology conference | 2018

In-Situ Stress Determination of Electroless Cu on PCB-Relevant Substrates

Tobias Bernhard; Ralf Brüning; Tanu Sharma; Delilah A. Brown; Laurence J. Gregoriades; Edith Steinhaeuser; Stefan Kempa; Frank Brüning; Edward Alexandre Luy

Thin Solid Films | 2018

Nickel dependence of hydrogen generation, hydrogen co-deposition and film stress in an electroless copper process

Tanu Sharma; Alexandre E. Landry; Alexandre Leger; Delilah A. Brown; Tobias Bernhard; Sebastian Zarwell; Frank Brüning; Ralf Brüning

Archive | 2018

METHOD FOR PROVIDING A MULTILAYER COATING ON A SURFACE OF A SUBSTRATE

Tobias Bernhard; Anna Peter; Michael Merschky; Frank Brüning; Taybet Bilkay-Troni; Heiko Brunner

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Frank Brüning

Atotech

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Ralf Brüning

Mount Allison University

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Tanu Sharma

Mount Allison University

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Delilah A. Brown

Mount Allison University

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Sebastian Zarwell

Atotech

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Laurence J. Gregoriades

Atotech

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Michael Merschky

Technical University of Berlin

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Simon Bamberg

Atotech

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Edith Steinhäuser

Atotech

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Hailuo Fu

Atotech

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