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Latest external collaboration on country level. Dive into details by clicking on the dots.

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Dive into the research topics where Tomohiro Yokochi is active.

Publication


Featured researches published by Tomohiro Yokochi.


Archive | 2002

Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device

Koji Kondo; Tomohiro Yokochi; Toshihiro Miyake; Satoshi Takeuchi


Archive | 2002

Printed board and manufacturing method thereof

Koji Kondo; Ryohei Kataoka; Tomohiro Yokochi; Makoto Nakagoshi; Tadashi Murai; Akimori Hayashi; Katsunobu Suzuki


Archive | 2002

Method for interconnecting printed circuit boards and interconnection structure

Toshihiro Miyake; Katsuaki Kojima; Hiroyasu Iwama; Makoto Totani; Yoshitaro Yazaki; Takehito Teramae; Tomohiro Yokochi; Kenzo Hirano; Tomoyuki Nanami


Archive | 2001

Printed wiring board and method of manufacturing a printed wiring board

Yoshitaro Yazaki; Yoshihiko Shiraishi; Koji Kondo; Toshikazu Harada; Tomohiro Yokochi


Archive | 2003

Connecting structure of printed circuit boards

Makoto Totani; Toshihiro Miyake; Tomohiro Yokochi; Takehito Teramae; Yoshitaro Yazaki; Kazuyuki Deguchi; Hajime Nakagawa


Archive | 2005

Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns

Akimori Hayashi; Katsunobu Suzuki; Ryuichi Oikawa; Makoto Nakagoshi; Naoko Sera; Tadashi Murai; Chiho Ogihara; Ryohei Kataoka; Koji Kondo; Tomohiro Yokochi


Archive | 2003

Method for manufacturing printed wiring board with embedded electric device

Koji Kondo; Tomohiro Yokochi; Toshihiro Miyake; Satoshi Takeuchi


Archive | 2003

Manufacturing method of rigid-flexible printed circuit board and structure thereof

Koji Kondo; Satoshi Takeuchi; Tomohiro Yokochi; Katsumi Yamazaki; Masakazu Terada


Archive | 2001

Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method

Koji Kondo; Tetsuaki Kamiya; Toshikazu Harada; Ryuichi Onoda; Yasutaka Kamiya; Gentaro Masuda; Yoshitaro Yazaki; Tomohiro Yokochi


Archive | 2005

Package substrate for a semiconductor device, a fabrication method for same, and a semiconductor device

Akimori Hayashi; Katsunobu Suzuki; Ryuichi Oikawa; Makoto Nakagoshi; Naoko Sera; Tadashi Murai; Chiho Ogihara; Ryohei Kataoka; Koji Kondo; Tomohiro Yokochi

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