Katsunobu Suzuki | Researchain

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Archive | 1996

Metal base package for a semiconductor device

Katsunobu Suzuki; Katsuhiko Suzuki; Akira Haga; Isamu Sorimachi; Hiroyuki Uchida

Archive | 1997

Package for a semiconductor device and a semiconductor device

Katsunobu Suzuki

Archive | 1998

Semiconductor device with metal base substrate having hollows

Katsunobu Suzuki; Hiroyuki Uchida

Archive | 1999

Package for a semiconductor device

Katsunobu Suzuki

Archive | 1996

Plastic molded IC package with leads having small flatness fluctuation

Katsunobu Suzuki; Akira Haga

Archive | 1999

Package for semiconductor chip having thin recess portion and thick plane portion

Katsunobu Suzuki

Archive | 1997

Package for packaging a semiconductor device suitable for being connected to a connection object by soldering

Katsunobu Suzuki

Archive | 2004

Semiconductor apparatus, package substrate therefor and manufacturing method thereof

Eishu Hayashi; Ryohei Kataoka; Koji Kondo; Tadashi Murai; Makoto Nakakoshi; Chiho Ogiwara; Ryuichi Oikawa; Naoko Sera; Katsunobu Suzuki; Tomohiro Yokochi; 誠中越; 隆一及川; 唯村井; 映守林; 智宏横地; 直子瀬羅; 良平片岡; 千穂荻原; 宏司近藤; 克信鈴木

Archive | 2000