Tomonori Nakamura

Annealing effects on single Shockley faults in 4H-SiC

We investigated the annealing effect on single Shockley faults (SSFs) in the SiC epitaxial layers by photoluminescence mapping in combination with high-power laser illumination. Comparing before and after annealing at 350–550°C, it became obvious that annealing results in the shrinking of the faulted area of SSFs. When high-power laser illumination is performed again on the same area annealed at 550°C, the right-angled triangular SSFs reformed into exactly the same features as those before annealing, but the isosceles triangular SSFs did not reform. The annealing temperature to start shrinking the faulted area differs according to the type of SSF.

A 4.15 kV 9.07-m/spl Omega//spl middot/cm/sup 2/ 4H-SiC Schottky-barrier diode using Mo contact annealed at high temperature

In this letter, we report the fabrication of high-voltage and low-loss 4H-SiC Schottky-barrier diodes (SBDs) with a performance close to the theoretical limit using a Mo contact annealed at high-temperature. High-temperature annealing for the Mo contact was found to be effective in controlling the Schottky-barrier height at 1.2-1.3 eV without degradation of n-factor and reverse characteristics. We successfully obtained a 1-mm/sup 2/ Mo-4H-SiC SBD with a breakdown voltage (V/sub b/) of 4.15 kV and a specific on resistance (R/sub on/) of 9.07 m/spl Omega//spl middot/cm/sup 2/, achieving a best V/sub b//sup 2//R/sub on/ value of 1898 MW/cm/sup 2/. We also obtained a 9-mm/sup 2/ Mo-4H-SiC SBD with V/sub b/ of 4.40 kV and R/sub on/ of 12.20 m/spl Omega//spl middot/cm/sup 2/.

Investigation of Basal Plane Dislocations in the 4H-SiC Epilayers Grown on {0001} Substrates

In this paper, we investigated the density of basal plane dislocations (BPDs) in 4H-SiC epilayers grown on (0001) and (000-1). Re-polishing of the substrate surface, in-situ H2 etching and off-cut angle were found to influence the propagation of BPDs into the epilayers. The epitaxial growth on (000-1) substrates yields a relatively low density of BPDs compared to growth on (0001). The electrical characteristics of pn diodes were also investigated, and the suppressed forward degradation and high-voltage blocking performance were obtained in the use of the (000-1) epilayers.

Growth of Thick 4H–SiC(0001) Epilayers and Reduction of Basal Plane Dislocations

We investigate basal plane dislocations (BPDs) in thick 4H–SiC(0001) epilayers and the formation of stacking faults in the active region of pin diodes. Synchrotron reflection X-ray topography shows that epitaxial growth on (0001) is advantageous in preventing the propagation of BPDs from the substrate into the epilayer and obtaining a low BPD density in the epilayer compared with growth on (0001). The current stress test of 4H–SiC(0001) pin diodes demonstrates the suppressed formation of stacking faults.

8.3 kV 4H-SiC PiN Diode on (000-1) C-Face with Small Forward Voltage Degradation

The dependence of forward voltage degradation on crystal faces for 4H-SiC pin diodes has been investigated. The forward voltage degradation has been reduced by fabricating the diodes on the (000-1) C-face off-angled toward <11-20>. High-voltage 4H-SiC pin diodes on the (000-1) C-face with small forward voltage degradation have also been fabricated successfully. A high breakdown voltage of 4.6 kV and DVf of 0.04 V were achieved for a (000-1) C-face pin diode. A 8.3 kV blocking performance, which is the highest voltage in the use of (000-1) C-face, is also demonstrated in 4H-SiC pin diode.

Comparison of Propagation and Nucleation of Basal Plane Dislocations in 4H-SiC(000-1) and (0001) Epitaxy

Propagation and nucleation of basal plane dislocations (BPDs) in 4H-SiC(000-1) and (0001) epitaxy were compared. Synchrotron reflection X-ray topography was performed before and after epitaxial growth to classify the BPDs into those propagated from the substrate into the epilayer and those nucleated in the epilayer. It was revealed that the propagation ratio of BPDs for the (000-1) epitaxy was significantly smaller than that for the (0001) epitaxy. Growing (000-1) epilayers at a high C/Si ratio of 1.2 achieves a further reduction in BPDs to only 3 cm-2 for those propagated from the substrate, and 16 cm-2 for those nucleated in the epilayer. A dramatic increase was also found in the nucleation of BPDs omitting the re-polishing and in-situ H2 etching procedure.

Development of Non-Destructive In-House Observation Techniques for Dislocations and Stacking Faults in SiC Epilayers

We have developed non-destructive in-house observation techniques for dislocations and stacking faults (SFs) in 4H-SiC epilayers. Low temperature photoluminescence (PL) mapping was carried out at 100K using He-Cd laser (325 nm) as an exciation source. PL mapping at ~420 nm was used to investigate basal plane dislocations (BPDs), Shockley stacking faults (SSFs) and boundary, while PL mapping at ~470 nm and 100K obtained in-grown SF images. In addition, using a high-resolution laboratory X-ray topography system with a four-crystal collimator, we succeeded in recording BPDs propagating along [11-20]. From the measurement results, new evaluation techniques for dislocations and SFs other than KOH etching and Synchotron radiation topography were demonstrated on Si- and C-face 4H-SiC epilayers.

Deep Level Defects Related to Carbon Displacements in n- and p-Type 4H-SiC

We have investigated the electrically active deep level defects in p- and n-type 4H-SiC after low energy electron irradiation. Intrinsic defects were created by irradiation with 200 keV electrons, with energy sufficient to move only the carbon atoms in SiC lattice. Defect spectra were compared between the p- and n-doped samples prepared under identical irradiation conditions. We probed both conduction and valence band sides of the band-gap by using capacitance transient techniques with electrical and optical trap filling. We have found that the defect spectrum in the p-type epilayers differs significantly from the n-type. The Z1/Z2, EH1 and EH3 electron traps which are usually present in irradiated n-type material could not be detected in p-type samples. An electron trap at 1.6 eV below the conduction band edge is present in both n- and p-type samples at the same energy position and with similar concentration, therefore it is probably related to the same type of defect. We have also found a new hole trap in p-type epilayers at energy EV + 0.66 eV.

Improvement in Electrical Performance of Schottky Contacts for High-Voltage Diode

We investigated the effect of high temperature annealing on the Schottky barrier height (Fb) and the ideality factor (n-factor) of a Mo contact. In a Mo contact, the Fb increased and the leakage current decreased by annealing at 600oC, while no increase in n-factor and forward excess current owing to the high temperature annealing was observed. The Schottky barrier diode with Mo contact annealed at 600oC showed a blocking-voltage (Vb) of 4.15 kV and a specific on resistance (Ron) of 9.07 mWcm2, achieving a high Vb 2/Ron value of 1898 MW/cm2.

Comparison of Electrical Characteristics of 4H-SiC(0001) and (000-1) Schottky Barrier Diodes

We compared the electrical characteristics of 4H-SiC(0001) and (000-1) Schottky barrier diodes (SBDs), and derived the Schottky barrier heights (Hbs) of Ta, W, Mo, and Pd on {0001}. We investigated the annealing temperature dependence of Hbs in Mo and the W Schottky contacts for (0001) and (000-1). The Hbs are increased by annealing, except for the W Schottky contact on (0001). The yields of 0.25 cm2 as-deposited Mo-SBDs were 93.3% for (0001) and 71.1% for (000-1), respectively. We also demonstrated over 1 cm2 (0001) as-deposited Mo-SBD with a low leakage current, an excellent ideality factor, and no excess current, encouraging the enlargement of the active area in the SBD.