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Dive into the research topics where Tomoshi Takahashi is active.

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Featured researches published by Tomoshi Takahashi.


Journal of Materials Science | 1999

Diffusion of zinc in commercial Al-Zn alloys under high pressure

Koji Hisayuki; Toshimi Yamane; Tomoshi Takahashi; Yoritoshi Minamino; Keiichi Hirao; Hideki Araki

The effective interdiffusion coefficients of zinc in commercial Al-Zn alloys are obtained within the temperature range 773 to 883 K under pressures from 0 to 0.41 GPa. From the temperature dependence of the effective interdiffusion coefficients, the activation energies for the 701, 703 and 705 alloys are evaluated to be 125, 124 and 127 kJ/mol respectively, and their pre-exponential factors are 3.0 × 10−5, 4.0 × 10−5, and 3.9 × 10−5 m2/s respectively. The activation volumes, ΔV, for diffusion of zinc in the commercial Al-Zn alloy are 8.30 × 10−6, and 8.60× 10−6 m3/mol at 823 and 883 K, respectively. The ratios of the activation volume to the molar volume of aluminum, ΔV/V0, are 0.83 at 823 K and 0.86 at 883 K. This means that the diffusion of zinc in the commercial Al-Zn alloys occurs predominantly by the monovacancy mechanism at 823 and 883 K.


Journal of Materials Science Letters | 1989

Interdiffusion in the copper-rich solid solutions of Cu-Ga and Cu-Mg alloys

Tomoshi Takahashi; Toshimi Yamane; Yoritoshi Minamino; T. Kimura

Determination des coefficients dans les domaines 0 a 13,4 at% Ga (0 a 4,5 at% Mg) et 1003 a 1203 K (968 a 1098 K)


Metallurgical and Materials Transactions A-physical Metallurgy and Materials Science | 1988

Effect of high pressure on interdiffusion in Cu-Zn alloys at temperatures near the melting point

Toshimi Yamane; Nobuki Mori; Yoritoshi Minamino; Yoshinari Miyamoto; M. Koizumi; Tomoshi Takahashi

Interdiffusion of copper and zinc alloys of Cu-28.5 at. pct Zn and Cu-4.9 at. pct Zn has been investigated under pressures from 0.101 to 3240 MPa in the temperature range from 1256 to 1377 K. The diffusion coefficients decrease with increasing pressure. The activation energy for impurity diffusion of zinc in copper increases with pressure. The ratio of the activation volume to the molar volume of copper is between 0.75 and 0.90. It is concluded that the impurity diffusion of zinc in copper occurs predominantly by the monovacancy mechanism at temperatures near the melting point of the alloy.


Journal of Materials Science | 1987

Interdiffusion inα solid solutions of the Cu-Zn-Sn system

Tomoshi Takahashi; Michitomo Kato; Yoritoshi Minamino; Toshimi Yamane

AbstractThe interdiffusion coefficients in the α f c c phase of Cu-Zn-Sn alloys,


Journal of The Japan Institute of Metals | 1998

Quaternary diffusion in the α solid solutions of Al-Zn-Mg-Cu system

Tomoshi Takahashi; Kazutaka Miura; Yoritoshi Minamino; Keiichi Hirao; Toshimi Yamane


Materials Transactions | 2003

Interdiffusion in Co Solid Solutions of Co-Al-Cr-Ni System at 1423 K

Yoritoshi Minamino; Yuichiro Koizumi; Nobuhiro Tsuji; Toru Yamada; Tomoshi Takahashi

\tilde D_{SnSn}^{Cu} , \tilde D_{SnZn}^{Cu} , \tilde D_{ZnZn}^{Cu} and \tilde D_{ZnSn}^{Cu}


Materials Transactions | 2008

Interdiffusion in β Phase of the Ternary Ti-Al-V System

Tomoshi Takahashi; Yoritoshi Minamino; Masao Komatsu


Journal of Alloys and Compounds | 2012

Ternary diffusion and thermodynamic interaction in the β solid solutions of Ti–Al–Fe alloys at 1423 K

Tomoshi Takahashi; Yoritoshi Minamino

, have been determined at 1073 K. The concentration profiles indicate that the diffusion rate of tin is greater than that of zinc in the Cu-Zn-Sn alloy. The diffusion paths show the typical S-shaped curves. All of the four interdiffusion coefficients are positive and they are very sensitive to the solute concentration. The atomic mobilities of the three diffusing elements in Kirkendall planes increase in the order of Cu, Zn, Sn. The interaction energy of the Cu-Sn bond is much larger than that of the Zn-Sn bond. From the results of the present work it seems that the Onsager reciprocal relation holds in the a phase of the Cu-Zn-Sn system.


Journal of Materials Science Letters | 1985

Interdiffusion in the aluminium-rich solid solution of Al-Cu alloys

Yoritoshi Minamino; Toshimi Yamane; Tomoshi Takahashi

Quaternary interdiffusion experiments of Al-rich α Al-Zn-Mg-Cu alloys have been performed in the temperature range from 755 to 833 K. The concentration profiles indicate that the diffusion distance of Cu is shorter than those of Zn and Mg in the solid solutions. The direct interdiffusion coefficients D 4 ZnZn , D 4 MgMg and D 4 CuCu are positive, and indirect coefficients are negative. The impurity diffusion coefficients of Zn (or Cu) in Al-Cu(or Zn) -Mg alloys can be expressed by the follwing equations. D * Zn(Al-Cu-Mg) =3.9 × 10 -5 exp (-124 kJ mol -1 /RT -1 ) m 2 /s, D * Cu(Al-Zn-Mg) =5.7 ×10 -5 exp (-132 kJ mol -1 /RT -1 ) m 2 /s. From the ratio values of indirect coefficient to direct one, it is expected that attractive interactions of Zn-Mg, Zn-Cu and Cu-Mg atoms exist in the Al-Zn-Mg-Cu alloys.


Journal of Materials Science Letters | 1988

Interdiffusion in the copper-rich solid solution of Cu-Si alloys

Yoritoshi Minamino; Toshimi Yamane; T. Kimura; Tomoshi Takahashi

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Toshimi Yamane

Hiroshima Institute of Technology

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Koji Hisayuki

Hiroshima Institute of Technology

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Michitomo Katoh

Niihama National College of Technology

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Michitomo Kato

Niihama National College of Technology

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