Toshimitsu Hamada

Pattern Inspection Techniques for SEM Image

We have developed pattern inspection techniques for Integrated Circuit elements which use an SEMI (Scanning Electron Microscope). In this paper we will discuss the transformation of low SP1 ratio SEM image signals into binary values, detection techniques using the SEM to detect patterns on insulating materials, and detection algorithms for defects.

Precise alignment technique for TAB inner-lead bonding

A precise alignment technique for inner-lead bonding of TAB (tape automated bonding), called direct alignment, is described. In this technique, inner leads on a tape and bumps on a LSI (large-scale integration) chip are detected at the bonding station. The position of leads is detected from the projection waveform of a dark-field illuminated image, where complicated background information of LSI patterns is eliminated. The position of bumps, which are partially concealed by the leads, is detected from the projection waveform of a bright-field illuminated image by utilizing the lead position information detected before. This technique has been applied to an automatic TAB inner-lead bonder, and alignment accuracy after bonding of less than +5 mu m is achieved.<<ETX>>