Toshimitsu Ishikawa

Semiconductor integrated circuit devices having particular terminal geometry

Semiconductor device with smaller package having leads with alternating offset projections

Resin sealed semiconductor device having power source by-pass connecting line

Apparatus for manufacturing a semiconductor device

PLASTIC MOLD TYPE SEMICONDUCTOR DEVICE

Semiconductor integrated circuit devices having particular terminal geometry and mounting method

Semiconductor device with smaller package

Plastic mould type semiconductor device

Plastic moulded semiconductor device

Kunststoffummantelte Halbleiteranordnung. Plastic-coated semiconductor device.