Toshiya Sakamoto

Development of sheet type thermal conductive compound using AlN

The conventional sheet type thermal conductive compound is processed by uniformly mixing high thermal conductivity materials into the organic resin. However, it is difficult to raise the sheet thermal conductivity using this compound, due to the fact that the organic resin lies between materials of high thermal conductivity. In order to solve the above-mentioned problem, the authors developed a new type of thermal sheet having thermal conductivity above 20 W/m.k, as measured with a steady state thermal conductivity meter. The proposed sheet type thermal conductive compound was formed by penetrating finely processed aluminum nitride ceramic, which was arranged uniformly, on both sides of the organic resin sheet (thermal hardening silicone). The thermal sheet formed in this way has high thermal conductivity, good electrical insulation property, and flexibility.