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Featured researches published by Toyoki Ito.


Archive | 1997

Process for producing multilayer printed circuit board for wire bonding

Naoyuki Urasaki; Kouichi Tsuyama; Kazuhito Kobayashi; Norio Okano; Hiroshi Shimizu; Nobuyuki Ogawa; Akishi Nakaso; Toyoki Ito; Daisuke Fujimoto; Kazuhisa Otsuka; Shigeharu Arike; Yoshiyuki Tsuru


Archive | 2006

Method Of Treating The Surface Of Copper And Copper

Tomoaki Yamashita; Yasuo Inoue; Masaharu Matsuura; Toyoki Ito; Akira Shimizu; Fumio Inoue; Akishi Nakaso


Archive | 2000

MANUFACTURE OF BUILD-UP MULTILAYER INTERCONNECTION BOARD

Shigeharu Ariga; Masashi Isono; Toyoki Ito; Akishi Nakaso; Kazuhisa Otsuka; Yuichi Shimayama; Kanetoshi Shinada; Masao Sugano; 昭士 中祖; 豊樹 伊藤; 詠逸 品田; 和久 大塚; 裕一 島山; 茂晴 有家; 雅司 磯野; 雅雄 菅野


Archive | 1997

BUILD-UP MULTILAYER PRINTED WIRING BOARD AND MANUFACTURE THEREOF

義之 ▲つる▼; Shigeharu Ariga; Toyoki Ito; Akishi Nakaso; Kazuhisa Otsuka; Masao Sugano; Yoshiyuki Tsuru; Naoyuki Urasaki; 昭士 中祖; 豊樹 伊藤; 和久 大塚; 茂晴 有家; 直之 浦崎; 雅雄 菅野


Archive | 1998

Manufacture of build-up multilayered printed wiring board

Shigeharu Ariga; Toyoki Ito; Akishi Nakaso; Kazuhisa Otsuka; Masao Sugano; Naoyuki Urasaki; 昭士 中祖; 豊樹 伊藤; 和久 大塚; 茂晴 有家; 直之 浦崎; 雅雄 菅野


Archive | 2003

Semiconductor chip mounting substrate, semiconductor package, and manufacturing method of them

Yoshinori Ejiri; Fumio Inoue; Toyoki Ito; Masaharu Matsuura; Akishi Nakaso; 昭士 中祖; 文男 井上; 豊樹 伊藤; 雅晴 松浦; 芳則 江尻


Archive | 2001

Wiring plate and manufacturing method thereof, semiconductor mounting substrate and manufacturing method thereof, semiconductor package and manufacturing method thereof

Shigeharu Ariga; Toshihiro Endo; Toyoki Ito; Akishi Nakaso; Kenji Takai; Naoyuki Urasaki; 昭士 中祖; 豊樹 伊藤; 茂晴 有家; 直之 浦崎; 俊博 遠藤; 健次 高井


Archive | 2008

Copper etching liquid and manufacturing method of printed wiring board using the same

Shigeharu Ariga; Toyoki Ito; Akishi Nakaso; Kenji Takai; Naoyuki Urasaki; 昭士 中祖; 豊樹 伊藤; 茂晴 有家; 直之 浦崎; 健次 高井


Archive | 2003

Semiconductor chip mounting board, semiconductor package, and manufacturing method thereof

Yoshinori Ejiri; Fumio Inoue; Toyoki Ito; Masaharu Matsuura; Akishi Nakaso; Naoyuki Urasaki; 昭士 中祖; 文男 井上; 豊樹 伊藤; 雅晴 松浦; 芳則 江尻; 直之 浦崎


Archive | 2008

Method for producing electroless plated resin particle

Kunihiko Akai; Toyoki Ito; 豊樹 伊藤; 邦彦 赤井

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