Akishi Nakaso | Researchain

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Featured researches published by Akishi Nakaso.

Archive | 1998

Substrate for mounting semiconductor chips

Naoyuki Urasaki; Yasusi Simada; Yoshiyuki Tsuru; Akishi Nakaso; Itsuo Watanabe

Archive | 1988

Process for treating copper surface

Akishi Nakaso; Toshiro Okamura; Haruo Ogino; Tomoko Watanabe; Yuko Kimura

Archive | 1997

Process for producing multilayer printed circuit board for wire bonding

Naoyuki Urasaki; Kouichi Tsuyama; Kazuhito Kobayashi; Norio Okano; Hiroshi Shimizu; Nobuyuki Ogawa; Akishi Nakaso; Toyoki Ito; Daisuke Fujimoto; Kazuhisa Otsuka; Shigeharu Arike; Yoshiyuki Tsuru

Archive | 1994

Metal foil for printed wiring board and production thereof

Naoyuki Urasaki; Kouichi Tsuyama; Kiyoshi Hasegawa; Shuichi Hatakeyama; Akinari Kida; Akishi Nakaso; Hiroshi Nomura

Archive | 1993

Printed wiring board and production thereof

Akishi Nakaso; Kouichi Tsuyama; Akinari Kida; Shuichi Hatakeyama; Naoyuki Urasaki

Archive | 1978

Method of improving adhesion between insulating substrates and metal deposits electrolessly plated thereon, and method of making additive printed circuit boards

Yorio Iwasaki; Toshiro Okamura; Akishi Nakaso; Nobuo Uozu; Hiroshi Takahashi

Archive | 1996

Prepreg for printed circuit board

Norio Okano; Kazuhito Kobayashi; Akishi Nakaso

Archive | 1997

ADHESIVE FILM HAVING SHIELDING EFFECT AND TRANSPARENCY FOR ELECTROMAGNETIC WAVE, AND DISPLAY AND ELECTROMAGNETIC WAVE SHIELDING CONFIGURATION USING THE FILM

Akishi Nakaso; Atsushi Takahashi; Minoru Tosaka; Koichi Tsuyama; Toshishige Uehara; Kazunori Yamamoto; 寿茂上原; 昭士中祖; 和徳山本; 宏一津山; 実登坂; 敦之高橋

Archive | 1997

Electronic component parts device

Kenzo Takemura; Itsuo Watanabe; Akira Nagai; Osamu Watanabe; Kazuyoshi Kojima; Akishi Nakaso; Kazunori Yamamoto; Yoshiyuki Tsuru; Teiichi Inada; Yasushi Shimada

Archive | 1997