Tsung-Sheng Kang

Isolation blocking voltage of nitrogen ion-implanted AlGaN/GaN high electron mobility transistor structure

Nitrogen ion-implanted AlGaN/GaN high electron mobility transistor structures showed an isolation blocking voltage of 900 V with a leakage current at 1 μA/mm across an implanted isolation-gap of 10 μm between two Ohmic pads. The effect of implanted gap distance (1.7, 5, or 10 μm) between two Ohmic contact pads was evaluated. The isolation current density was determined to be solely dependent on the applied field between the contact pads. A model using a combination of resistive current and Poole–Frenkel current is consistent with the experimental data. The resistance of the isolation implantation region significantly decreased after the sample was annealed at temperatures above 600 °C.

Characterization of the gate oxide of an AlGaN/GaN high electron mobility transistor

A subnanometer thick interfacial oxide layer present between the Ni/Au gate metal stack and semiconducting epilayers of an AlGaN/GaN high electron mobility transistor was characterized using high-angle annular dark-field scanning transmission electron microscopy and laser-assisted atom probe tomography. It was revealed that the oxide is composed of distinct Ni-oxide-rich and Al-oxide-rich layers with no Ga-oxide detected. The results provide information that is of potential importance in determining failure mechanisms and improving reliability of AlGaN/GaN high electron mobility transistors.

Improvement of Off-State Stress Critical Voltage by Using Pt-Gated AlGaN/GaN High Electron Mobility Transistors

By replacing the commonly used Ni/Au gate metallization with Pt/Ti/Au, the critical voltage for degradation of AlGaN/GaN High Electron Mobility Transistors (HEMTs) during off-state biasing stress was significantly increased. The typical critical voltage for the HEMTs with Ni/Au gate metallization was around -55V. By sharp contrast, no critical voltage was observed for the HEMTs with Pt/Ti/Au gate metallization, even up -100V, which was the instrumental limitation in this experiment. Both Schottky forward and reverse gate characteristics of the Ni/Au degraded once the gate voltage passed the critical voltage of -55V. There was no degradation exhibited for the HEMTs with Pt/Ti/Au gate metallization.

Field-induced defect morphology in Ni-gate AlGaN/GaN high electron mobility transistors

AlGaN/GaN high electron mobility transistors were electrically stressed using off-state high reverse gate biases. In devices demonstrating the largest, most rapid decrease in normalized maximum drain current, defects were found at the gate/AlGaN epilayer interface and characterized using high-angle annular dark-field scanning transmission electron microscopy. These defects appear to be a reaction between the Ni layer of the Ni/Au gate metal stack and the AlGaN epilayer. Additionally, simulations of the electric field lines from the defective devices match the defect morphology. These results provide important insight toward understanding failure mechanisms and improving reliability of Ni-gate AlGaN/GaN high electron mobility transistors.

Effect of buffer layer structure on electrical and structural properties of AlGaN/GaN high electron mobility transistors

AlGaN/GaN high electron mobility transistors (HEMTs) with similar active layers structures were grown on SiC or sapphire substrates using different buffer layer structures, including GaN of different thickness (1 or 2 μm) or composite AlGaN/GaN buffers. The highest density of hole traps was observed in the buffer on sapphire, while the lowest density of hole traps was obtained in the thick (2 μm) GaN buffer on SiC. The reverse leakage currents in HEMTs were lower in the devices grown on SiC substrates and the on-off ratios improved by two orders of magnitude for thicker GaN buffers or composite AlGaN/GaN buffers compared to a standard 1 μm GaN buffer. The maximum drain-source currents and tranconductances were all larger for the devices on SiC compared to sapphire.

Effects of silicon nitride passivation on isolation-blocking voltage in algan/gan high electron mobility transistors

The effects of plasma enhanced vapor deposited silicon nitride (SiNx) passivation layer thickness and the spacing between the contact windows openings in the SiNx layer on the isolation-blocking voltage of nitrogen ion implanted AlGaN/GaN high electron mobility transistors were studied. The isolation-blocking voltage was proportional to the thickness of the SiNx passivation layer. Early breakdown was observed for the samples without thick enough SiNx due to surface breakdown. The device was permanently damaged after the occurrence of this early breakdown. The dependence of the isolation-blocking voltage on the SiNx thickness was also modeled and the general trends of the simulated results were in good agreement with the experiment data. The effect of rf power used for depositing the SiNx layer on the isolation-blocking voltage was also studied. Ion bombardments during the SiNx deposition could cause the reduction of breakdown voltage. By employing optimized SiNx passivation conditions, a saturation drain ...

Comparison of passivation layers for AlGaN/GaN high electron mobility transistors

AlGaN/GaN high electron mobility transistors require surface passivation layers to reduce the effects of surface traps between the gate and drain contacts. These traps lead to the creation of a virtual gate and the associated collapse of drain current under rf conditions. The authors have investigated three different materials for passivation layers, namely thin (7.5 nm) Al2O3 and HfO2 deposited with an atomic layer deposition system and conventional, thick (200 nm) plasma enhanced chemically vapor deposited SiNX. The latter is found to be the most effective in reducing drain current loss during gate lag measurements in both single and double pulse mode, but also reduces fT and fMAX through additional parasitic capacitance.

Investigation of traps in AlGaN/GaN high electron mobility transistors by sub-bandgap optical pumping

Sub-bandgap optical pumping with wavelengths of 671, 532, or 447 nm was employed to study traps in AlGaN/GaN high electron mobility transistors. The trap energies were determined from the Arrhenius plots of transient drain current at different temperatures. Prominent states were located around 0.7 eV below the conduction band, and these are commonly reported to be nonradiative traps due to defects trapped on dislocations or possibly Ga interstitials. In addition, traps located at 1.9 and 2.35 eV below the conduction band were found, which have been reported as NGa antisite and VGa–ON complexes, respectively. The postillumination drain current decays were analyzed with a persistent photoconductivity method, and time constants were extracted and associated with the recapture process in the AlGaN barrier and GaN channel layers.

Under-gate defect formation in Ni-gate AlGaN/GaN high electron mobility transistors

Abstract High electron mobility transistors based on Aluminum Gallium Nitride/Gallium Nitride heterostructures are poised to become the technology of choice for a wide variety of high frequency and high power applications. Their reliability in the field, particularly the reliability of the gate electrode under high reverse bias, remains an ongoing concern, however. Rapid increases in gate leakage current have been observed in devices which have undergone off-state stressing. Scanning Electron Microscopy, scanning probe microscopy, and Transmission Electron Microscopy have been used to evaluate physical changes to the structure of Ni-gated devices as the gate leakage current begins its initial increase. This evaluation indicates the formation of an interfacial defect similar to erosion under the gate observed by other authors. Defect formation appears to be dependent upon electrical field as well as temperature. Transmission Electron Microscopy has been used to demonstrate that a chemical change to the interfacial oxynitride layer present between the semiconductor and gate metal appears to occur during the formation of this defect. The interfacial layer under the gate contact transitions from a mixed oxynitride comprised of gallium and aluminum to an aluminum oxide.

Degradation of dc characteristics of InAlN/GaN high electron mobility transistors by 5 MeV proton irradiation

The dc characteristics of InAlN/GaN high electron mobility transistors were measured before and after irradiation with 5 MeV protons at doses up to 2 × 1015 cm−2. The on/off ratio degraded by two orders of magnitude for the highest dose, while the subthreshold slope increased from 77 to 122 mV/decade under these conditions. There was little change in transconductance or gate or drain currents for doses up to 2 × 1013 cm−2, but for the highest dose the drain current and transconductance decreased by ∼40% while the reverse gate current increased by a factor of ∼6. The minority carrier diffusion length was around 1 μm independent of proton dose. The InAlN/GaN heterostructure is at least as radiation hard as its AlGaN/GaN counterpart.