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Publication


Featured researches published by Tsutomu Asai.


Archive | 1999

Resin-coated composite foil, production and use thereof

Tetsuro Sato; Tsutomu Asai; Kenichiro Iwakiri


Archive | 1999

Resin applied composite foil, production thereof, multilayered copper clad laminated sheet using composite foil and production of multilayered printed wiring board

Tsutomu Asai; Kenichiro Iwakiri; Tetsuro Sato


Archive | 1997

Resin composition for copper-clad laminate, copper foil with resin, multilayer copper-clad laminate and multilayer printed circuit board

Tsutomu Asai; Tetsuro Sato; 哲朗 佐藤; 務 浅井


Archive | 2000

Resin compound for composing insulating interlayer of print circuit board, resin sheet for forming insulating layer using the resin compound and copper-plated laminate using them

Tsutomu Asai; Tetsuro Sato; 哲朗 佐藤; 務 浅井


Archive | 2001

Copper foil with resin and printed wiring board using the same

Tsutomu Asai; Toshifumi Matsushima; Tetsuro Sato; 哲朗 佐藤; 敏文 松島; 務 浅井


Archive | 2001

Resin compound for fabricating interlayer dielectric of printed wiring board, resin sheet and resin applied-copper foil for forming insulating layer using the resin compound, and copper-clad laminate using them

Tetsuro Sato; Tsutomu Asai


Archive | 2002

Resin-coated copper foil, and printed wiring board using resin-coated copper foil

Tetsuro Sato; Tsutomu Asai; Toshifumi Matsushima


Archive | 1999

Resin-coated composite foil, production thereof, and productions of multilayer copper-clad laminate and multilayer printed wiring board using resin-coated composite foil

Tetsuro Sato; Tsutomu Asai; Kenichiro Iwakiri


Archive | 2003

Resin-coated copper foil, and sprinted wiring board using resin-coated copper foil

Tetsuro Sato; Tsutomu Asai; Toshifumi Matsushima


Archive | 2001

Resin compound for forming interlayer insulating layer of printed wiring board, resin sheet and copper foil with resin for forming insulating layer using the resin compound, and copper-clad laminate using them

Tetsuro Sato; Tsutomu Asai

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