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Dive into the research topics where Uwe Seidel is active.

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Featured researches published by Uwe Seidel.


Microelectronic Engineering | 2000

Comparison of copper damascene and aluminum RIE metallization in BICMOS technology

H Helneder; Heinrich Körner; Andrea Mitchell; Markus Schwerd; Uwe Seidel

Modern interconnect schemes will be using copper instead of aluminum as metallization material due to its better electrical conductivity and its superior electromigration resistance. Using a production worthy BICMOS process it could be revealed that especially for this kind of application a copper dual damascene metallization offers serious advantages versus an aluminum RIE/tungsten plug approach. Interconnect parameters which are very helpful for high-performance RF technologies like line and via resistances can be reduced showing equal leakage current properties. Current density can be increased and up to now no impact on Bipolar and only slight influence on CMOS devices, which needs to be investigated in more detail, is detected.


Archive | 2010

Through substrate via semiconductor components

Albert Birner; Uwe Hoeckele; Thomas Kunstmann; Uwe Seidel


Archive | 2012

Micromechanical sound transducer having a membrane support with tapered surface

Wolfgang Klein; Uwe Seidel; Stefan Barzen; Mohsin Nawaz; Wolfgang Friza; Xu Cheng; Alfons Dehe


Archive | 2010

Semiconductor structure and method for making same

Rainer Leuschner; Gunther Mackh; Uwe Seidel


Archive | 1995

Method for preventing redeposition of etching products onto substrate surfaces during a tungsten re-etching process in the production of LSI circuits

Uwe Seidel; Rainer Braun


Archive | 2009

Method for producing a copper connection between two sides of a substrate

Uwe Seidel; Thorsten Obernhuber; Albert Birner; Georg Ehrentraut


Archive | 2009

Durch-Substrat-Via-Halbleiterkomponenten

Albert Birner; Uwe Hoeckele; Thomas Kunstmann; Uwe Seidel


Archive | 2009

Method for Producing an Electrically Conductive Connection

Uwe Seidel; Thorsten Obernhuber; Albert Birner; Georg Ehrentraut


Archive | 2013

Semiconductor device and method for manufacturing a semiconductor

Gabriele Bettineschi; Uwe Seidel; Wolfgang Walter; Michael Schrenk; Hubert Werthmann


Archive | 2009

Method for making conductive interconnects

Rainer Leuschner; Gunther Mackh; Uwe Seidel

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