Virginia D. Wheeler

Low-Loss, Extreme Subdiffraction Photon Confinement via Silicon Carbide Localized Surface Phonon Polariton Resonators

Plasmonics provides great promise for nanophotonic applications. However, the high optical losses inherent in metal-based plasmonic systems have limited progress. Thus, it is critical to identify alternative low-loss materials. One alternative is polar dielectrics that support surface phonon polariton (SPhP) modes, where the confinement of infrared light is aided by optical phonons. Using fabricated 6H-silicon carbide nanopillar antenna arrays, we report on the observation of subdiffraction, localized SPhP resonances. They exhibit a dipolar resonance transverse to the nanopillar axis and a monopolar resonance associated with the longitudinal axis dependent upon the SiC substrate. Both exhibit exceptionally narrow linewidths (7-24 cm(-1)), with quality factors of 40-135, which exceed the theoretical limit of plasmonic systems, with extreme subwavelength confinement of (λ(res)3/V(eff))1/3 = 50-200. Under certain conditions, the modes are Raman-active, enabling their study in the visible spectral range. These observations promise to reinvigorate research in SPhP phenomena and their use for nanophotonic applications.

Bilayer graphene grown on 4H-SiC (0001) step-free mesas.

We demonstrate the first successful growth of large-area (200 × 200 μm(2)) bilayer, Bernal stacked, epitaxial graphene (EG) on atomically flat, 4H-SiC (0001) step-free mesas (SFMs) . The use of SFMs for the growth of graphene resulted in the complete elimination of surface step-bunching typically found after EG growth on conventional nominally on-axis SiC (0001) substrates. As a result heights of EG surface features are reduced by at least a factor of 50 from the heights found on conventional substrates. Evaluation of the EG across the SFM using the Raman 2D mode indicates Bernal stacking with low and uniform compressive lattice strain of only 0.05%. The uniformity of this strain is significantly improved, which is about 13-fold decrease of strain found for EG grown on conventional nominally on-axis substrates. The magnitude of the strain approaches values for stress-free exfoliated graphene flakes. Hall transport measurements on large area bilayer samples taken as a function of temperature from 4.3 to 300 K revealed an n-type carrier mobility that increased from 1170 to 1730 cm(2) V(-1) s(-1), and a corresponding sheet carrier density that decreased from 5.0 × 10(12) cm(-2) to 3.26 × 10(12) cm(-2). The transport is believed to occur predominantly through the top EG layer with the bottom layer screening the top layer from the substrate. These results demonstrate that EG synthesized on large area, perfectly flat on-axis mesa surfaces can be used to produce Bernal-stacked bilayer EG having excellent uniformity and reduced strain and provides the perfect opportunity for significant advancement of epitaxial graphene electronics technology.

Graphene nanoribbon field-effect transistors on wafer-scale epitaxial graphene on SiC substrates a

We report the realization of top-gated graphene nanoribbon field effect transistors (GNRFETs) of ∼10 nm width on large-area epitaxial graphene exhibiting the opening of a band gap of ∼0.14 eV. Contrary to prior observations of disordered transport and severe edge-roughness effects of graphene nanoribbons (GNRs), the experimental results presented here clearly show that the transport mechanism in carefully fabricated GNRFETs is conventional band-transport at room temperature and inter-band tunneling at low temperature. The entire space of temperature, size, and geometry dependent transport properties and electrostatics of the GNRFETs are explained by a conventional thermionic emission and tunneling current model. Our combined experimental and modeling work proves that carefully fabricated narrow GNRs behave as conventional semiconductors and remain potential candidates for electronic switching devices.

Graphene functionalization and seeding for dielectric deposition and device integration

Graphene has recently attracted wide-spread attention because of its unique transport and physical properties that are appealing for a wide range of electronic applications. Integration with scalable high-κ dielectrics is important for the realization of graphene-based top-gated electronic devices, including next generation THz applications. Atomic layer deposition (ALD), a low temperature deposition method based on two separate self-limiting surface reactions, is a preferred technique to achieve high-quality, conformal, ultrathin dielectric films with precise control of thickness and chemical composition at the atomic scale. Unfortunately, ALD of oxides on graphene is hindered by the inertness of the graphene surface. To alleviate this graphene-oxide incompatibility, several different functionalization and seeding methods have recently been developed to render the graphene more susceptible to the ALD process of high-κ dielectrics including: ozone, wet chemical and fluorine pretreatments, low-k polymer se...

Epitaxial graphene surface preparation for atomic layer deposition of Al2O3

Atomic layer deposition was employed to deposit relatively thick (∼30 nm) aluminum oxide (Al2O3) using trimethylaluminum and triply-distilled H2O precursors onto epitaxial graphene grown on the Si-face of silicon carbide. Ex situ surface conditioning by a simple wet chemistry treatment was used to render the otherwise chemically inert graphene surface more amenable to dielectric deposition. The obtained films show excellent morphology and uniformity over large (∼64 mm2) areas (i.e., the entire sample area), as determined by atomic force microscopy and scanning electron microscopy. X-ray photoelectron spectroscopy revealed a nearly stoichiometric film with reduced impurity content. Moreover, from capacitance-voltage measurements a dielectric constant of ∼7.6 was extracted and a positive Dirac voltage shift of ∼1.0 V was observed. The graphene mobility, as determined by van der Pauw Hall measurements, was not affected by the sequence of surface pretreatment and dielectric deposition.

Lateral Graphene Heterostructure Field-Effect Transistor

We report the first experimental demonstration of a lateral graphene heterostructure field-effect transistor (HFET) at wafer scale, where the graphene heterostructure channel consists of epitaxial graphene (Gr)/fluorographene (GrF)/graphene (Gr). GrF is a widebandgap material, providing a potential barrier to lateral carrier transport. Gate bias modulation of the Gr/GrF/Gr barrier via an electric field effect results in normally-off enhancement-mode graphene HFETs with an ON-OFF switching ratio of 105 at room temperature. These devices also demonstrate excellent current-voltage saturation, providing a potential path for active RF applications.

Epitaxial Growth of III–Nitride/Graphene Heterostructures for Electronic Devices

Epitaxial GaN films were grown by metal organic chemical vapor deposition (MOCVD) on functionalized epitaxial graphene (EG) using a thin (~11 nm) conformal AlN nucleation layer. Raman measurements show a graphene 2D peak at 2719 cm-1 after GaN growth. X-ray diffraction analysis reveals [0001]-oriented hexagonal GaN with (0002) peak rocking curve full width at the half maximum (FWHM) of 544 arcsec. The FWHM values are similar to reported values for GaN grown by MOCVD on sapphire. The GaN layer has a strong room-temperature photoluminescence band edge emission. Successful demonstration of GaN growth on EG opens up the possibility of III–nitride/graphene heterostructure-based electronic devices and promises improved performance.

Direct observation of basal-plane to threading-edge dislocation conversion in 4H-SiC epitaxy

The propagation behavior of basal plane dislocations from off-oriented 4H-SiC substrates into homoepitaxial layers has been investigated using transmission electron microscopy (TEM), secondary electron microscopy (SEM), and chemical etching. Cross-sectional TEM shows that basal plane dislocations in the substrate are dissociated into pairs of partial dislocations separated by a stacking fault with a width of about 40 nm. Near the substrate/epilayer interface, where most of the basal plane dislocations convert to threading edge dislocations, the two partials constrict before converting. Threading edge segments are inclined by about 20° from the c-axis toward the down-step direction. It is concluded that the critical and limiting step of the dislocation conversion process is constriction of the dissociated partials. Growth surface morphology at the emergence point of the basal plane dislocation was imaged using SEM and is thought to play an important role in the constriction.

Achieving clean epitaxial graphene surfaces suitable for device applications by improved lithographic process

It is well-known that the performance of graphene electronic devices is often limited by extrinsic scattering related to resist residue from transfer, lithography, and other processes. Here, we report a polymer-assisted fabrication procedure that produces a clean graphene surface following device fabrication by a standard lithography process. The effectiveness of this improved lithography process is demonstrated by examining the temperature dependence of epitaxial graphene-metal contact resistance using the transfer length method for Ti/Au (10 nm/50 nm) metallization. The Landauer-Buttiker model was used to explain carrier transport at the graphene-metal interface as a function of temperature. At room temperature, a contact resistance of 140 Ω-μm was obtained after a thermal anneal at 523 K for 2 hr under vacuum, which is comparable to state-of-the-art values.

Epitaxial metallic β-Nb2N films grown by MBE on hexagonal SiC substrates

RF-plasma MBE was used to epitaxially grow 4- to 100-nm-thick metallic β-Nb2N thin films on hexagonal SiC substrates. When the N/Nb flux ratios are greater than one, the most critical parameter for high-quality β-Nb2N is the substrate temperature. The X-ray characterization of films grown between 775 and 850 °C demonstrates β-Nb2N phase formation. The (0002) and X-ray diffraction measurements of a β-Nb2N film grown at 850 °C reveal a 0.68% lattice mismatch to the 6H-SiC substrate. This suggests that β-Nb2N can be used for high-quality metal/semiconductor heterostructures that cannot be fabricated at present.