Network
Latest external collaboration on country level. Dive into details by clicking on the dots.
Publication
Featured researches published by Vladimir V. Talanov.
Superconductor Science and Technology | 2015
Quentin P. Herr; Joshua Osborne; M.J.A. Stoutimore; Harold Hearne; Ryan Selig; Jacob Vogel; Eileen Min; Vladimir V. Talanov; Anna Yurievna Herr
We report the design and test of Reciprocal Quantum Logic shift-register yield vehicles consisting of up to 72,800 Josephson junction devices per die, the largest digital superconducting circuits ever reported. Multiple physical layout styles were matched to the MIT Lincoln Laboratory foundry, which supports processes with both four and eight metal layers and minimum feature size of 0.5 {\mu}m. The largest individual circuits with 40,400 junctions indicate large operating margins of
international symposium on the physical and failure analysis of integrated circuits | 2013
Jan Gaudestad; Nicolas Gagliolo; Vladimir V. Talanov; R. H. Yeh; C. J. Ma
\pm
Superconductor Science and Technology | 2014
Vladimir V. Talanov; Nesco M. Lettsome; Valery Borzenets; Nicolas Gagliolo; Alfred B. Cawthorne; Antonio Orozco
20% on AC clock amplitude. In one case the data were reproducible to the accuracy of the measurement,
international symposium on the physical and failure analysis of integrated circuits | 2015
Yen-Hao Jack Chen; Po Chih Huang; Vladimir V. Talanov; Antonio Orozco; Jan Gaudestad
\pm
international reliability physics symposium | 2013
Jan Gaudestad; Vladimir V. Talanov; Antonio Orozco; Khai Ling Khoo
1% across five thermal cycles using only the rudimentary precautions of passive mu-metal magnetic shielding and a controlled cool-down rate of 3 mK/s in the test fixture. We conclude that with proper mitigation techniques, flux-trapping is no longer a limiting consideration for very-large-scale-integration of superconductor digital logic.
THE PHYSICS OF SEMICONDUCTORS: Proceedings of the 31st International Conference on the Physics of Semiconductors (ICPS) 2012 | 2013
Vladimir V. Talanov; Christopher Del Barga; Lee Wickey; Mekan Ovezmyradov; Eric A. Shaner; Aaron Gin; Nikolai G. Kalugin
Magnetic Field Imaging (MFI) technology is capable of localize shorts using Magnetic Current Imaging (MCI) technique with a very high spatial resolution [1]. In this paper we demonstrate that a Giant Magneto Resistance (GMR) sensor positioned in close proximity to the front side of a die sample enables MFI to achieve sub micron resolution.
Bulletin of the American Physical Society | 2012
Vladimir V. Talanov; Nesco M. Lettsome; Antonio Orozco; Alfred B. Cawthorne; Valery Borzenets
We developed a scanning SQUID microscope utilizing DC SQUID with novel readout electronics capable of sensing coherent magnetic fields from 50 to 200 MHz. To overcome the bandwidth limitation of traditional closed-loop SQUID magnetometers, we employ a flux-modulated closed loop to simultaneously lock the quasi-static magnetic flux and flux-bias the SQUID for amplification of RF flux. Demodulating the SQUID voltage with a double lock-in technique yields the signal proportional to the amplitude and phase of RF magnetic field. We describe the system performance and present images of a variety of samples.
Archive | 2011
Antonio Orozco; Vladimir V. Talanov; Alfred B. Cawthorne; Nesco M. Lettsome
Magnetic Field Imaging (MFI) is a widely used technique in the Semiconductor industry for non-destructive Electrical Fault Isolation (EFI) for shorts, leakages and opens. When the devices shrink and the mobile electronics industry has a more strict criteria for speed with low power consumption, making High Resistance Opens (HRO) failures more important to detect. We show in this paper two cases in which magnetic field phase analysis using MFI helped localize HRO failures that were causing delays and slower speed in addition to higher power consumption.
Archive | 2011
Antonio Orozco; Vladimir V. Talanov; Alfred B. Cawthorne; Nicholas Eric Gagliolo
Space Domain Reflectometry (SDR) is a new technique that has already shown to be a reliable non-destructive method to image open failures in semiconductor chips by pumping a high frequency signal into the open trace. We show in this paper that SDR can be used to accurately find a breakage location in copper wire bond that failed during stress test.
Archive | 2015
Quentin P. Herr; Joshua Osborne; M.J.A. Stoutimore; Harold Heame; Ryan Selig; Jacob Vogel; Eileen Min; Vladimir V. Talanov; Anna Y. Herr
We report on microwave response of graphene and graphite measured using electric field and magnetic field-detecting near-field scanning probe microwave microscopes.