Walter Wegleiter

Recent progress of AlGaInP thin-film light-emitting diodes

The concept of an AlGaInP thin-film light emitting diode includes a structure of semiconductor layers with low optical absorption on which a highly reflective mirror is applied. After bonding this wafer to a suitable carrier, the absorbing GaAs substrate is removed. Subsequently, electrical contacts and an efficient light scattering mechanism for rays propagating within the chip is provided. To achieve high efficiency operation it is crucial to optimize all functional parts of the device, such as the mirror, contacts, and active layer. Different mirrors consisting of combinations of dielectrics and metals have been tested. New chip designs have been evaluated to reduce the absorption at the ohmic contacts of the device. For efficient light scattering, the surface roughness of the at the emission window has to be optimized. Using these structures, and a thin active layer consisting of five compressively strained quantum wells, an external quantum efficiency of 40% is demonstrated at 650 nm. Further improvement is expected. Since the AlGaInP material system can provide only poor carrier confinement for active layers emitting in the yellow wavelength regime, the internal efficiency of these LEDs is comparably low. In order to reduce the problem of carrier leakage, a yellow active region usually consists of some hundred nanometers of active material. To circumvent the problem of this highly absorbing active layer, a separation of the light generation and the area of light extraction is suggested for yellow thin-film LEDs. First results are presented in this paper.

High-efficiency red and infrared light-emitting diodes using radial outcoupling taper

In this paper, we give an overview of light-emitting diodes (LEDs) with radial tapers. Light is generated in the very center of a circularly symmetrical structure and is outcoupled at a tapered ring. Encapsulated devices with an emission wavelength of 980 nm achieve wallplug efficiencies of 48%. Non-encapsulated InGaAlP-based red-emitting LEDs show quantum efficiencies of 13%. A new device design combines the taper with a wafer-scale soldering technique promising a feasible fabrication method.

Scalability of buried microreflector light-emitting diodes for high-current applications

The combination of wafer soldering using metal layers and the introduction of buried micro-reflector structures has proven to be a promising approach to fabricate high brightness, substrate-less LEDs in the AlGaInP material system. In addition to the enhanced light output, the scalability of this approach has been predicted as a major advantage. In contrast to other approaches, larger area LEDs can be fabricated without altering the epitaxial structure and thickness of layers simply by offering a larger area for light generation. First samples of amber (λ = 615 nm) buried micro-reflector LEDs with side-length up to 1000 μm have been realized. Devices mounted in packages with improved heat sinks are capable of low voltage CW operation with currents as high as 600 mA (Vfw≤ 2,8 V) without significant thermal flattening of the light-current characteristics. The maximum luminous flux achieved at these oeprating conditions is 46 lumen. Already these first experiments demonstrate the potential of the concept of buried micro-reflector LEDs not only for high-brightness but also for high-current operation. The results are among the best values of high-flux LEDs in this wavelength range.

InGaAlP thin film LEDs with high luminous efficiency

In Thinfilm LEDs, the substrate absorption of the generated light is avoided by a metal reflector between the light emitting layer and the substrate. The light extraction can be further enhanced by buried microreflectors or surface texturing. We demonstrate that the combination of these technologies gives prospects equal or superior to all other known approaches in terms of luminous efficiency and luminance. At a peak wavelength of 617 nm, we have obtained a luminous efficiency of 95.7 lm/W at 20 mA. We further analyze the internal and light extration efficiencies of our LEDs using raytracing simulations as well as a theoretical model for the internal efficiency. This analysis shows quantitatively that the efficient light extraction from InGaAlP thinfilm LEDs becomes more and more difficult when approaching shorter wavelengths.

Efficient InAlGaP light-emitting diodes using radial outcoupling taper

We present results on efficient InGaAlP light-emitting diodes using lateral outcoupling taper. This concept is based on light generation in the very central area of a circularly symmetric structure and, after light propagation between two mirrors, outcoupling in a tapered mesa region. We have demonstrated the suitability of this concept on As-based Light-Emitting Diodes emitting at 980 nm. Since the idea is not limited to a certain material system, we fabricated InGaAlP-based LEDs emitting in the red wavelength regime. By adjusting the process flow to the new material system we were able to achieve external quantum efficiencies in the range of 13% for unencapsulated devices. Additionally we present a new concept combining the idea of outcoupling tapers with a waferscale soldering technique. First samples show external quantum efficiencies in the range of 11%.