Axel Kaltenbacher

Module with an electronic component electrically connected between two substrates, in particular DCB ceramic substrates, and production method thereof

Method for electrical insulation of unpackaged electronic construction element, particularly high power element or semiconductor high power element, involves fastening or electrical contacting of connection surface on lower surface

Modul mit elektronischem Bauelement zwischen zwei Substraten, insbesondere DCB-Keramiksubstraten, dessen Herstellung und Kontaktierung

Einheitlich normierte Leistungspackages

The optoelectronic component

Standardized power packages independent of the assembly of components

Method for contacting electronic components by means of a substrate plate

Verfahren zur Herstellung und Kontaktierung von elektronischen Bauelementen mittels einer Substratplatte, insbesondere DCB-Keramik-Substratplatte

Method for the Production and Contacting of Electronic Components by Means of a Substrate Plate, Particularly a DCB Ceramic Substrate Plate

Boîtiers de puissance standardisés indépendants de l'assemblage de composants