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Dive into the research topics where Will Barbara is active.

Publication


Featured researches published by Will Barbara.


Archive | 2000

Verfahren zur Herstellung hochdotierter Halbleiterbauelemente

Spitz Richard; Goerlach Alfred; Will Barbara; Uebbing Helga; Adamski Christian; Riekert Roland


Archive | 2011

Verfahren zum Ausbilden von Gräben in einem Halbleiterbauelement

Reinmuth Jochen; Will Barbara; Weber Heribert


Archive | 2011

Method for producing electrical interlayer connection in substrate of micro-component or sensor, involves opening mask layer over substrate area provided for electrical interlayer connection, where mask layer is applied on substrate

Reinmuth Jochen; Will Barbara; Weber Heribert


Archive | 2012

Micromechanical component e.g. acceleration sensor, manufacturing method, involves forming trench of sacrificial layer under gitter mask structures that remain overstretched after etching of structures, and closing structures

Reinmuth Jochen; Will Barbara; Weber Heribert


Archive | 2014

Verfahren zum Realisieren eines vertikalen Ätzstopps für einen Tiefätzprozess und entsprechend präpariertes Halbleitersubstrat

Schary Timo; Urban Andrea; Bergmann Yvonne; Will Barbara; Weber Heribert


Archive | 2014

Halbleitersubstrat mit einer dielektrischen Ätzstoppschicht für einen Ionentiefätz-Prozess

Schary Timo; Urban Andrea; Bergmann Yvonne; Will Barbara; Weber Heribert


Archive | 2014

Sensor mit Membran und Herstellungsverfahren

Reinmuth Jochen; Will Barbara; Weber Heribert


Archive | 2011

PROCEDIMENTO PER FORMARE TRINCEE IN UN COMPONENTE A SEMICONDUTTORE

Will Barbara; Weber Heribert; Leinenbach Christina


Archive | 2010

Electromechanical microstructure for e.g. acceleration sensor, has movable elements connected with substrate and with area made of partially monocrystalline silicon, and spring with area made of partially polycrystalline silicon

Reinmuth Jochen; Butz Juergen; Will Barbara


Archive | 2008

Method for manufacturing structural body by etching process, involves measuring etching progress during process, where etching progress is locally determined at measuring point by optical measurement particularly by polarimetric inferometer

Will Barbara; Ulbrich Nicolaus

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