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Will K. Wong

National Semiconductor

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Publication

Featured researches published by Will K. Wong.

Archive | 2010

Thin foil semiconductor package

Jaime A. Bayan; Nghia Thuc Tu; Will K. Wong; David Chin

Archive | 2009

Foil based semiconductor package

Anindya Poddar; Nghia Thuc Tu; Jaime A. Bayan; Will K. Wong; David Chin

Archive | 2009

Thin foil for use in packaging integrated circuits

Anindya Poddar; Jaime A. Bayan; Nghia Thuc Tu; Will K. Wong; Ken Pham

Archive | 2011

Method and leadframe for packaging integrated circuits

Will K. Wong; Nghia Thuc Tu; Jaime A. Bayan

Archive | 2012

LOW PROFILE PACKAGE AND METHOD

Tao Feng; Will K. Wong; Ashok S. Prabhu; Hau T. Nguyen; Anindya Poddar

Archive | 2007

GANG FLIPPING FOR FLIP-CHIP PACKAGING

Anindya Poddar; Jaime A. Bayan; Ashok S. Prabhu; Will K. Wong

Archive | 2010

LASER ABLATION ALTERNATIVE TO LOW COST LEADFRAME PROCESS

Nghia Thuc Tu; Will K. Wong; Jaime A. Bayan; Jesus Rocha; Anindya Poddar

Archive | 2008

Method of making foil based semiconductor package

Will K. Wong; Nghia Thuc Tu; Jaime A. Bayan; David Chin

Archive | 2010

BACKMETAL REPLACEMENT FOR USE IN THE PACKAGING OF INTEGRATED CIRCUITS

Nghia Thuc Tu; Will K. Wong; Jamie A. Bayan

Archive | 2009

Foil plating for semiconductor packaging

Jaime A. Bayan; Nghia Thuc Tu; Will K. Wong

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Collaboration

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Jaime A. Bayan

National Semiconductor

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Nghia Thuc Tu

National Semiconductor

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Anindya Poddar

National Semiconductor

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David Chin

National Semiconductor

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Ashok S. Prabhu

National Semiconductor

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Hau T. Nguyen

National Semiconductor

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Jamie A. Bayan

National Semiconductor

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Jesus Rocha

National Semiconductor

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Ken Pham

National Semiconductor

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Tao Feng

National Semiconductor

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