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William John Slattery

IBM

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Publication

Featured researches published by William John Slattery.

Archive | 1991

Method of making a planarized thin film covered wire bonded semiconductor package

H. Ward Conru; Gary Hugh Irish; Francis Joseph Pakulski; William John Slattery; Stephen George Starr; William C. Ward

Archive | 1992

Planarized thin film surface covered wire bonded semiconductor package

Ward H Conru; Gary Hugh Irish; Francis Joseph Pakulski; William John Slattery; Stephen George Starr; William Caroll Ward

Archive | 1987

Planarized ceramic substrates

Kenneth Lambert Elias; Stuart R. Martin; William John Slattery

Archive | 1992

Method of forming a planarized thin film surface covered wire bonded semiconductor package

Ward H Conru; Gary Hugh Irish; Francis Joseph Pakulski; William John Slattery; Stephen George Starr; William Caroll Ward

Archive | 1992

Herstellungsverfahren einer Halbleiterpackung mit Drähten und eine Oberfläche mit planarisierter Dünnfilmdecke Manufacturing method of a semiconductor package with wires and a surface with a planarized thin film Blanket

Ward H Conru; Gary Hugh Irish; Francis Joseph Pakulski; William John Slattery; Stephen George Starr; William Caroll Ward

Archive | 1992

Halbleiterpackung mit Drähten und eine Oberfläche mit planierter Dünnfilmdecke

Ward H Conru; Gary Hugh Irish; Francis Joseph Pakulski; William John Slattery; Stephen George Starr; William Caroll Ward

Archive | 1992

Herstellungsverfahren einer Halbleiterpackung mit Drähten und eine Oberfläche mit planarisierter Dünnfilmdecke

Ward H Conru; Gary Hugh Irish; Francis Joseph Pakulski; William John Slattery; Stephen George Starr; William Caroll Ward

Archive | 1992

Herstellungsverfahren einer Halbleiterpackung mit Drähten und eine Oberfläche mit planarisierter Dünnfilmdecke Method of manufacturing a semiconductor package with wires and a surface having a planarized thin film ceiling

Ward H Conru; Gary Hugh Irish; Francis Joseph Pakulski; William John Slattery; Stephen George Starr; William Caroll Ward

Archive | 1992

Manufacturing method of a semiconductor package with wires and a surface with a planarized thin film cover

Ward H Conru; Gary Hugh Irish; Francis Joseph Pakulski; William John Slattery; Stephen George Starr; William Caroll Ward

Archive | 1986

Method of smoothing the surface of a ceramic substrate

Kenneth Lambert Elias; Stuart R. Martin; William John Slattery

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Francis Joseph Pakulski

IBM

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Gary Hugh Irish

IBM

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Stephen George Starr

IBM

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Ward H Conru

IBM

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William Caroll Ward

IBM

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Kenneth Lambert Elias

IBM

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Stuart R. Martin

IBM

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H. Ward Conru

IBM

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William C. Ward

IBM

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