Network


Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Gary Hugh Irish is active.

Publication


Featured researches published by Gary Hugh Irish.


Archive | 1991

Method of making a planarized thin film covered wire bonded semiconductor package

H. Ward Conru; Gary Hugh Irish; Francis Joseph Pakulski; William John Slattery; Stephen George Starr; William C. Ward


Archive | 1992

Planarized thin film surface covered wire bonded semiconductor package

Ward H Conru; Gary Hugh Irish; Francis Joseph Pakulski; William John Slattery; Stephen George Starr; William Caroll Ward


Archive | 1993

Encapsulated semiconductor chip module and method of forming the same

Francis Eugene Froebel; David L. Gardell; Gary Hugh Irish; Mohammed S. Shaikh


Archive | 1996

Leadframe having contact pads defined by a polymer insulating film

James L. Carper; Gary Hugh Irish; Sheldon Cole Rieley; Robert M. Smith; Robert L. Jackson


Archive | 2000

Planarized plastic package modules for integrated circuits

David V. Caletka; James L. Carper; John Cincotta; Kibby B. Horsford; Gary Hugh Irish; John J. Lajza; Gordon C. Osborne; Charles R. Ramsey; Robert M. Smith; Michael J. Vadnais


Archive | 1994

Improved encapsulated semiconductor chip module and method of forming the same

Francis Eugene Froebel; David L. Gardell; Gary Hugh Irish; Mohammed S. Shaikh


Archive | 1992

Method of forming a planarized thin film surface covered wire bonded semiconductor package

Ward H Conru; Gary Hugh Irish; Francis Joseph Pakulski; William John Slattery; Stephen George Starr; William Caroll Ward


Archive | 2001

Planarized plastic modules for integrated circuits

David V. Caletka; James L. Carper; John Cincotta; Kibby B. Horsford; Gary Hugh Irish; John J. Lajza; Gordon C. Osborne; Charles R. Ramsey; Robert M. Smith; Michael J. Vadnais


Archive | 1992

Herstellungsverfahren einer Halbleiterpackung mit Drähten und eine Oberfläche mit planarisierter Dünnfilmdecke Manufacturing method of a semiconductor package with wires and a surface with a planarized thin film Blanket

Ward H Conru; Gary Hugh Irish; Francis Joseph Pakulski; William John Slattery; Stephen George Starr; William Caroll Ward


Archive | 1992

Halbleiterpackung mit Drähten und eine Oberfläche mit planierter Dünnfilmdecke

Ward H Conru; Gary Hugh Irish; Francis Joseph Pakulski; William John Slattery; Stephen George Starr; William Caroll Ward

Researchain Logo
Decentralizing Knowledge