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Dive into the research topics where William M. Beckenbaugh is active.

Publication


Featured researches published by William M. Beckenbaugh.


Archive | 1996

Method of forming contact pads for wafer level testing and burn-in of semiconductor dice

William M. Beckenbaugh; William H. Lytle; Bernard Berman


Archive | 1991

Solder plate reflow method for forming a solder bump on a circuit trace intersection

Kevin D. Moore; John W. Stafford; William M. Beckenbaugh; Ken Cholewczynski


Archive | 1991

Solder plate reflow method for forming solder-bumped terminals

Kevin D. Moore; John W. Stafford; William M. Beckenbaugh; Ken Cholewczynski


Archive | 1992

Low temperature-wetting tin-base solder paste

Cynthia M. Melton; Andrew Skipor; William M. Beckenbaugh


Archive | 1992

Solder plate reflow method for forming a solder bump on a circuit trace.

Kevin D. Moore; John W. Stafford; William M. Beckenbaugh; Kenneth Cholewczynski


Archive | 1996

Method for forming a microelectronic assembly

Daniel Joseph Viza; Dennis Miller; William M. Beckenbaugh; Conrad S. Monroe; Kent W. Hansen


Archive | 1990

Palladium-coated solder ball

Cynthia M. Melton; Carl J. Raleigh; Steven M. Scheifers; William M. Beckenbaugh


Archive | 1994

Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties

Cynthia M. Melton; William M. Beckenbaugh; Dennis Miller


Archive | 1992

Liquid crystal display device with pixel registration illumination

Kevin W. Jelley; George T. Valliath; William M. Beckenbaugh


Archive | 1994

TIN-BISMUTH SOLDER PASTE AND METHOD OF USE

Cynthia M. Melton; William M. Beckenbaugh; Dennis Miller

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Dive into the William M. Beckenbaugh's collaboration.

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