William P. Eaton

Micromachined pressure sensors: Review and recent developments

Since the discovery of piezoresistivity in silicon in the mid 1950s, silicon-based pressure sensors have been widely produced. Micromachining technology has greatly benefited from the success of the integrated circuit industry, borrowing materials, processes, and toolsets. Because of this, microelectromechanical systems (MEMS) are now poised to capture large segments of existing sensor markets and to catalyse the development of new markets. Given the emerging importance of MEMS, it is instructive to review the history of micromachined pressure sensors, and to examine new developments in the field. Pressure sensors will be the focus of this paper, starting from metal diaphragm sensors with bonded silicon strain gauges, and moving to present developments of surface-micromachined, optical, resonant, and smart pressure sensors. Considerations for diaphragm design will be discussed in detail, as well as additional considerations for capacitive and piezoresistive devices. Results from surface-micromachined pressure sensors developed by the authors will be presented. Finally, advantages of micromachined sensors will be discussed.

The effect of humidity on the reliability of a surface micromachined microengine

Humidity is shown to be a strong factor in the wear of rubbing surfaces in polysilicon micromachines. We demonstrate that very low humidity can lead to very high wear without a significant change in reliability. We show that the volume of wear debris generated is a function of the humidity in an air environment. As the humidity decreases, the wear debris generated increases. For the higher humidity levels, the formation of surface hydroxides may act as a lubricant. The dominant failure mechanism has been identified as wear. The wear debris has been identified as amorphous oxidized silicon. Large slivers (approximately 1 /spl mu/m in length) of debris observed at the low humidity level were also amorphous oxidized silicon. Using transmission electron microscopy (TEM), we observed that the wear debris forms spherical and rod-like shapes. We compared two surface treatment processes: a fluorinated silane chain (FTS) process and supercritical CO/sub 2/ dried (SCCO/sub 2/) process. The microengines using the SCCO/sub 2/ process were found to be less reliable than those released with the FTS process under two humidity levels.

MEMS Reliability: Infrastructure, Test Structures, Experiments, and Failure Modes

The burgeoning new technology of Micro-Electro-Mechanical Systems (MEMS) shows great promise in the weapons arena. We can now conceive of micro-gyros, micro-surety systems, and micro-navigators that are extremely small and inexpensive. Do we want to use this new technology in critical applications such as nuclear weapons? This question drove us to understand the reliability and failure mechanisms of silicon surface-micromachined MEMS. Development of a testing infrastructure was a crucial step to perform reliability experiments on MEMS devices and will be reported here. In addition, reliability test structures have been designed and characterized. Many experiments were performed to investigate failure modes and specifically those in different environments (humidity, temperature, shock, vibration, and storage). A predictive reliability model for wear of rubbing surfaces in microengines was developed. The root causes of failure for operating and non-operating MEMS are discussed. The major failure mechanism for operating MEMS was wear of the polysilicon rubbing surfaces. Reliability design rules for future MEMS devices are established.

The effect of frequency on the lifetime of a surface micromachined microengine driving a load

Experiments have been performed on surface micromachined microengines driving load gears to determine the effect of the rotation frequency on median cycles to failure. We did observe a frequency dependence and have developed a model based on fundamental wear mechanisms and forces exhibited in resonant mechanical systems. Stressing loaded microengines caused observable wear in the rotating joints and, in a few instances, led to fracture of the pin joint in the drive gear.

First Reliability Test of a Surface Micromachined Microengine Using SHiMMeR

The first-ever reliability stress test on surface micromachined microengines developed at Sandia National Laboratories has been completed. We stressed 41 microengines at 36,000 RPM and inspected the functionality at 60 RPM. We have observed an infant mortality region, a region of low failure rate, and no signs of wearout in the data. The reliability data are presented and interpreted using standard reliability methods. Failure analysis results on the stressed microengines are presented. In our effort to study the reliability of MEMS, we need to observe the failures of large numbers of parts to determine the failure modes. To facilitate testing of large numbers of micromachines, we designed and built an automated system that has the capability to simultaneously test 256 packaged micromachines. The Sandia high volume measurement of micromachine reliability system has computer controlled positioning and the capability to inspect moving parts. The development of this parallel testing system is discussed in detail.

Frequency dependence of the lifetime of a surface micromachined microengine driving a load

Abstract Experiments have been performed on surface micromachined microengines driving load gears to determine the rotational frequency dependence on median cycles to failure. A sample of 272 microengines, each driving a load, was stressed at eight different frequencies. Frequency dependence was observed and a model was developed based on fundamental wear mechanisms and forces exhibited in resonant mechanical systems. Stressing loaded microengines caused observable wear in the rotating joints and in a few instances led to fracture of the pin joint in the drive gear.

Development of characterization tools for reliability testing of MicroElectroMechanical system actuators

Characterization tools have been developed to study the performance characteristics and reliability of surface micromachined actuators. These tools include: (1) the ability to electrically stimulate or stress the actuator, (2) the capability to visually inspect the devices in operation, (3) a method for capturing operational information, and (4) a method to extract performance characteristics from the operational information. Additionally, a novel test structure has been developed to measure electrostatic forces developed by a comb drive actuator.

Planar surface-micromachined pressure sensor with a sub-surface, embedded reference pressure cavity

Planar, surface micromachined pressure sensors have been fabricated by an extension of the chemical-mechanical polishing (CMP) process. CMP eliminates many of the fabrication problems associated with the photolithography, dry etch, and metallization of non-planar devices. FUrthermore, CMP adds additional design flexibility. The senors are based upon deformable, silicon nitride diaphragms with polysilicon piezoresistors. Absolute pressure is detected by virtue of reference pressure cavities underneath the diaphragms. Process details are discussed and characteristics from many devices are presented.

Characterization of a Surface Micromachined Pressure Sensor Array

A surface micromachined pressure sensor array has been designed and fabricated. The sensors are based upon deformable, silicon nitride diaphragms with polysilicon piezoresistors. Absolute pressure is detected by virtue of reference pressure cavities underneath the diaphragms. For this type of sensor, design tradeoffs must be made among allowable diaphragm deflection, diaphragm size, and desireable pressure ranges. Several fabrication issues were observed and addressed. Offset voltage, sensitivity, and nonlinearity of 100 micrometers diameter sensors were measured.

Characterization techniques for surface-micromachined devices

Using a microengine as the primary test vehicle, we have examined several aspects of characterization. Parametric measurements provide fabrication process information. Drive signal optimization is necessary for increased microengine performance. Finally, electrical characterization of resonant frequency and quality factor can be more accurate than visual techniques.