Winnie Wong

The Medipix3RX: a high resolution, zero dead-time pixel detector readout chip allowing spectroscopic imaging

The Medipix3 chips have been designed to permit spectroscopic imaging in highly segmented hybrid pixel detectors. Spectral degradation due to charge sharing in the sensor has been addressed by means of an architecture in which adjacent pixels communicate in the analog and digital domains on an event-by-event basis to reconstruct the deposited charge in a neighbourhood prior to the assignation of the hit to a single pixel. The Medipix3RX chip architecture is presented. The first results for the characterization of the chip with 300 μm thick Si sensors are given. ~ 72e− r.m.s. noise and ~ 40e− r.m.s. of threshold dispersion after chip equalization have been measured in Single Pixel Mode of operation. The homogeneity of the image in Charge Summing mode is comparable to the Single Pixel Mode image. This demonstrates both modes are suitable for X-ray imaging applications.

Review of hybrid pixel detector readout ASICs for spectroscopic X-ray imaging

Semiconductor detector readout chips with pulse processing electronics have made possible spectroscopic X-ray imaging, bringing an improvement in the overall image quality and, in the case of medical imaging, a reduction in the X-ray dose delivered to the patient. In this contribution we review the state of the art in semiconductor-detector readout ASICs for spectroscopic X-ray imaging with emphasis on hybrid pixel detector technology. We discuss how some of the key challenges of the technology (such as dealing with high fluxes, maintaining spectral fidelity, power consumption density) are addressed by the various ASICs. In order to understand the fundamental limits of the technology, the physics of the interaction of radiation with the semiconductor detector and the process of signal induction in the input electrodes of the readout circuit are described. Simulations of the process of signal induction are presented that reveal the importance of making use of the small pixel effect to minimize the impact of the slow motion of holes and hole trapping in the induced signal in high-Z sensor materials. This can contribute to preserve fidelity in the measured spectrum with relatively short values of the shaper peaking time. Simulations also show, on the other hand, the distortion in the energy spectrum due to charge sharing and fluorescence photons when the pixel pitch is decreased. However, using recent measurements from the Medipix3 ASIC, we demonstrate that the spectroscopic information contained in the incoming photon beam can be recovered by the implementation in hardware of an algorithm whereby the signal from a single photon is reconstructed and allocated to the pixel with the largest deposition.

Characterization of the Medipix3 pixel readout chip

The Medipix3 chip is a hybrid pixel detector readout chip working in Single Photon Counting Mode. It has been developed with a new front-end architecture aimed at eliminating the spectral distortion produced by charge diffusion in highly segmented semiconductor detectors. In the new architecture charge deposited in overlapping clusters of four pixels is summed event-by-event and the incoming quantum is assigned as a single hit to the summing circuit with the biggest charge deposit (this mode of operation is called Charge Summing Mode (CSM)). In Single Pixel Mode (SPM) the charge reconstruction and the communication between neighbouring pixels is disabled. This is the operating mode in traditional detector systems. This paper presents the results of the characterization of the chip with electrical stimuli and radioactive sources.

A prototype hybrid pixel detector ASIC for the CLIC experiment

A prototype hybrid pixel detector ASIC specifically designed to the requirements of the vertex detector for CLIC is described and first electrical measurements are presented. The chip has been designed using a commercial 65 nm CMOS technology and comprises a matrix of 64 × 64 square pixels with 25 μm pitch. The main features include simultaneous 4-bit measurement of Time-over-Threshold (ToT) and Time-of-Arrival (ToA) with 10 ns accuracy, on-chip data compression and power pulsing capability.

Grating-based x-ray phase-contrast imaging with a multi energy-channel photon-counting pixel detector.

We have carried out grating-based x-ray differential phase-contrast measurements with a hybrid pixel detector in 16 energy channels simultaneously. A method for combining the energy resolved phase-contrast images based on energy weighting is presented. An improvement in contrast-to-noise ratio by 58.2% with respect to an emulated integrating detector could be observed in the final image. The same image quality could thus be achieved with this detector and with energy weighting at 60.0% reduced dose compared to an integrating detector. The benefit of the method depends on the object, spectrum, interferometer design and the detector efficiency.

Electrical measurements of a multi-mode hybrid pixel detector ASIC for radiation detection

We present the first electrical measurements of an application-specific integrated circuit (ASIC) to be used in a hybrid pixel detector intended for dosimetry and radiation detection. The dosimeter has three programmable modes of operation: photon counting mode, energy integration mode, and dosimetry mode. The ASIC comprises a matrix of 16 by 16 (256 total) square pixels of 220 μm pitch, providing 12.4 mm2 of segmented active area. Each pixel can be configured to operate in one of the three radiation measurement modes, with programmable-depth counters and shift registers to tailor the data word size and optimise the readout frame-rate in a given mode. The individual energies of impinging photons are determined through programmable analogue energy threshold discrimination, time over threshold measurement, or a combination thereof. Furthermore, the dosimetry mode contains 16 digital energy thresholds and automatically sorts data into 16 corresponding energy bin registers. The chips output is therefore pre-processed charge spectra of the radiation field. This paper discusses results from measurements taken using programmable test-pulses to inject controlled stimuli into the pixel circuits.

Towards a new generation of pixel detector readout chips

The Medipix3 Collaboration has broken new ground in spectroscopic X-ray imaging and in single particle detection and tracking. This paper will review briefly the performance and limitations of the present generation of pixel detector readout chips developed by the Collaboration. Through Silicon Via technology has the potential to provide a significant improvement in the tile-ability and more flexibility in the choice of readout architecture. This has been explored in the context of 3 projects with CEA-LETI using Medipix3 and Timepix3 wafers. The next generation of chips will aim to provide improved spectroscopic imaging performance at rates compatible with human CT. It will also aim to provide full spectroscopic images with unprecedented energy and spatial resolution. Some of the opportunities and challenges posed by moving to a more dense CMOS process will be discussed.

Design of the analog front-end for the Timepix3 and Smallpix hybrid pixel detectors in 130 nm CMOS technology

This paper describes a front-end for hybrid pixel readout chips, which was developed for the Timepix3 and Smallpix ASICs. The front-end contains a single-ended preamplifier with a structure for leakage current compensation which can handle both signal polarities, and a single-threshold discriminator with compensation for pixel-to-pixel mismatch. Preamplifier and discriminator are required to be fast, to allow a Time-Of-Arrival (TOA) measurement with a resolution of 1.56 ns. Time-Over-Threshold (TOT) is also measured; the monotonicity of TOT with respect to the input charge is greatly improved as compared to the previous Timepix chip. The analog area is only 55 μm × 13.5 μm. Timepix3 has already been fabricated and the first test results are also presented in this paper.

The VeloPix ASIC

VeloPix, a 130 nm CMOS technology chip with data driven and zero suppressed readout, will be used as a readout chip for the hybrid pixel system of the LHCb Vertex Locator (VELO) upgrade. The upgrade, scheduled for LHC Run-3, will enable the experiment to be read out at 40 MHz in trigger-less mode, with event selection being performed in the CPU farm. The highest occupancy ASICs will experience rates of more than 900 Mhits/s, and the closest pixels are 5.1 mm from the LHC beams. This paper will present the VeloPix ASIC along with the first test results without a sensor.

Characterization of the Dosepix detector with XRF and analog testpulses

Dosepix is a hybrid pixel detector based on the technology of the Medipix and Timepix detectors. The Dosepix detector has a matrix of 16 × 16 square pixels, with the sensor segmented into rows of small (55 μm) and big (220 μm) pixels. In addition to photon counting, the Dosepix detector has a time over threshold mode which permits energy resolved measurements. In this contribution, we present results of the characterization of the Dosepix detector regarding energy calibration and energy resolution. We calibrated the detectors with X-ray fluorescence (XRF) and analog testpulses. We determined a conversion factor from testpulse amplitude to energy. This work aims to develop a calibration method of the Dosepix detector without the need for radiation. In addition, Monte Carlo simulations with ROSI were carried out to compare energy deposition spectra reconstructed with the radiation-based calibration and with testpulse-based calibration.