Wolfgang Scharf

Phosphorus-containing flameproofing agents for epoxy resin materials

Process for the preparation of laminates

Semiconductor encapsulating epoxy resin compositions suitable for semiconductor encapsulation, their manufacture and use, semiconductor devices encapsulated therewith

PHOSPHORUS COMPOUNDS AND THEIR USE AS FLAME RETARDANT FOR POLYMERS

Processes for preparing laminated plastics

Compositions of epoxide resins and polyamide-polyimide blockcopolymers.

Polyamide-polyimide block copolymers - have good temp. stability and low thermal expansion coefficients, and are useful for prodn. of flexible printed circuit boards

Polyimide and polyamic acid compsns. modified with polyarylene ether - used in prodn. of flexible laminate with metal foil esp. for printed circuit with good solvent resistance and low thermal expansion coefft.

PROCESS FOR PREPARING LAMINATED PLASTICS

Epoxy resin compositions for encapsulating semiconductors, their preparation and use, and thus encapsulated semiconductor devices