Theobald Haug

Flexible base materials, their preparation and their use for printed circuits

Flexible, printed circuit

Process for the manufacture of maleimides

PROCESS FOR THE MANUFACTURE OF POLYADDITION PRODUCTS CONTAINING IMIDE GROUPS BY REACTION OF POLYMALEIMIDES WITH POLYHYDRIC PHENOLS USING AMINE CATALYST

Process for the manufacture of polyaddition products containing imide groups

Epoxy resins based on triglycidyl isocyanurate

Process for the preparation of crosslinked, unsaturated polymers and the polymers thus obtained

Process for producing aliphatically N-substituted maleimides

Epoxy resin mixtures containing an iron-arene complex and a particular amine

Use of flexible materials in printed circuits