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WonJun Ko

STATS ChipPAC Ltd

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Publication

Featured researches published by WonJun Ko.

Archive | 2012

Semiconductor Device and Method of Stacking Semiconductor Die in Mold Laser Package Interconnected By Bumps and Conductive Vias

Daesik Choi; WonJun Ko; JaEun Yun

Archive | 2011

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT SPREADER AND METHOD OF MANUFACTURE THEREOF

JaEun Yun; Jong Wook Ju; WonJun Ko; Hye Ran Lee

Archive | 2007

INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING MULTI-PACKAGE MODULE TECHNIQUES

WonJun Ko; SeungYun Ahn; DongSoo Moon

Archive | 2011

Semiconductor Device and Method of Forming a Low Profile Dual-Purpose Shield and Heat-Dissipation Structure

OhHan Kim; WonJun Ko; Daesik Choi

Archive | 2010

Integrated circuit packaging system with trenches and method of manufacture thereof

WonJun Ko; Oh Han Kim

Archive | 2008

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUPPORT STRUCTURE UNDER WIRE-IN-FILM ADHESIVE

WonJun Ko; BoHan Yoon; JoungUn Park

Archive | 2013

Semiconductor Device and Method of Forming Protective Coating Material Over Semiconductor Wafer to Reduce Lamination Tape Residue

JaEun Yun; HunTeak Lee; SeungYong Chai; WonJun Ko

Archive | 2011

Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereof

WonJun Ko; Sungmin Song; Jong Wook Ju; JaEun Yun; Hye Ran Lee

Archive | 2013

Semiconductor device and method of calibrating warpage testing system to accurately measure semiconductor package warpage

WonJun Ko; SeungYong Chai; OhHan Kim; GwangTae Kim; Kenny Lee

Archive | 2013

Dual-sided film-assist molding process

WonJun Ko; GwangTae Kim; KeoChang Lee

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Collaboration

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JaEun Yun

STATS ChipPAC Ltd

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Daesik Choi

STATS ChipPAC Ltd

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GwangTae Kim

STATS ChipPAC Ltd

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Hye Ran Lee

STATS ChipPAC Ltd

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Jong Wook Ju

STATS ChipPAC Ltd

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OhHan Kim

STATS ChipPAC Ltd

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SeungYong Chai

STATS ChipPAC Ltd

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Sungmin Song

STATS ChipPAC Ltd

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BoHan Yoon

STATS ChipPAC Ltd

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DongSoo Moon

STATS ChipPAC Ltd

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