OhHan Kim

Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield

Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV

Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties

Semiconductor Device and Method of Forming WLCSP Structure Using Protruded MLP

Semiconductor Device and Method of Forming Shielding Layer Grounded Through Metal Pillars Formed in Peripheral Region of the Semiconductor

Bond-on-lead: a novel flip chip interconnection technology for fine effective pitch and high I/O density

Semiconductor method of forming bump on substrate to prevent ELK ILD delamination during reflow process

Semiconductor Device and Method of Forming a Low Profile Dual-Purpose Shield and Heat-Dissipation Structure

Double-Sided Semiconductor Device and Method of Forming Top-Side and Bottom-Side Interconnect Structures

Semiconductor device and method of forming a thermally reinforced semiconductor die