Xiaoliang Zeng

Ice‐Templated Assembly Strategy to Construct 3D Boron Nitride Nanosheet Networks in Polymer Composites for Thermal Conductivity Improvement

Owing to the growing heat removal issue of modern electronic devices, polymer composites with high thermal conductivity have drawn much attention in the past few years. However, a traditional method to enhance the thermal conductivity of the polymers by addition of inorganic fillers usually creates composite with not only limited thermal conductivity but also other detrimental effects due to large amount of fillers required. Here, novel polymer composites are reported by first constructing 3D boron nitride nanosheets (3D-BNNS) network using ice-templated approach and then infiltrating them with epoxy matrix. The obtained polymer composites exhibit a high thermal conductivity (2.85 W m(-1) K(-1)), a low thermal expansion coefficient (24-32 ppm K(-1)), and an increased glass transition temperature (T(g)) at relatively low BNNSs loading (9.29 vol%). These results demonstrate that this approach opens a new avenue for design and preparation of polymer composites with high thermal conductivity. The polymer composites are potentially useful in advanced electronic packaging techniques, namely, thermal interface materials, underfill materials, molding compounds, and organic substrates.

Electronic Properties of MoS2–WS2 Heterostructures Synthesized with Two-Step Lateral Epitaxial Strategy

Formation of heterojunctions of transition metal dichalcogenides (TMDs) stimulates wide interest in new device physics and technology by tuning optical and electronic properties of TMDs. TMDs heterojunctions are of scientific and technological interest for exploration of next generation flexible electronics. Herein, we report on a two-step epitaxial ambient-pressure CVD technique to construct in-plane MoS2-WS2 heterostructures. The technique has the potential to artificially control the shape and structure of heterostructures or even to be more potentially extendable to growth of TMD superlattice than that of one-step CVD technique. Moreover, the unique MX2 heterostructure with monolayer MoS2 core wrapped by multilayer WS2 is obtained by the technique, which is entirely different from MX2 heterostructures synthesized by existing one-step CVD technique. Transmission electron microscopy, Raman and photoluminescence mapping studies reveal that the obtained heterostructure nanosheets clearly exhibit the modulated structural and optical properties. Electrical transport studies demonstrate that the special MoS2 (monolayer)/WS2 (multilayer) heterojunctions serve as intrinsic lateral p-n diodes and unambiguously show the photovoltaic effect. On the basis of this special heterostructure, depletion-layer width and built-in potential, as well as the built-in electric field distribution, are obtained by KPFM measurement, which are the essential parameters for TMD optoelectronic devices. With further development in future studies, this growth approach is envisaged to bring about a new growth platform for two-dimensional atomic crystals and to create unprecedented architectures therefor.

Silver Nanoparticle-Deposited Boron Nitride Nanosheets as Fillers for Polymeric Composites with High Thermal Conductivity

Polymer composites with high thermal conductivity have recently attracted much attention, along with the rapid development of the electronic devices toward higher speed and performance. However, a common method to enhance polymer thermal conductivity through an addition of high thermally conductive fillers usually cannot provide an expected value, especially for composites requiring electrical insulation. Here, we show that polymeric composites with silver nanoparticle-deposited boron nitride nanosheets as fillers could effectively enhance the thermal conductivity of polymer, thanks to the bridging connections of silver nanoparticles among boron nitride nanosheets. The thermal conductivity of the composite is significantly increased from 1.63 W/m-K for the composite filled with the silver nanoparticle-deposited boron nitride nanosheets to 3.06 W/m-K at the boron nitride nanosheets loading of 25.1 vol %. In addition, the electrically insulating properties of the composite are well preserved. Fitting the measured thermal conductivity of epoxy composite with one physical model indicates that the composite with silver nanoparticle-deposited boron nitride nanosheets outperforms the one with boron nitride nanosheets, owning to the lower thermal contact resistance among boron nitride nanosheets’ interfaces. The finding sheds new light on enhancement of thermal conductivity of the polymeric composites which concurrently require the electrical insulation.

Lateral Built‐In Potential of Monolayer MoS2–WS2 In‐Plane Heterostructures by a Shortcut Growth Strategy

Lateral WS2-MoS2 heterostructures are synthesized by a shortcut one-step growth recipe with low-cost and soluble salts. The 2D spatial distributions of the built-in potential and the related electric field of the lateral WS2-MoS2 heterostructure are quantitatively analyzed by scanning Kelvin probe force microscopy revealing the fundamental attributes of the lateral heterostructure devices.

Highly Stretchable and Sensitive Strain Sensor Based on Facilely Prepared Three-Dimensional Graphene Foam Composite

Wearable strain sensors with excellent stretchability and sensitivity have emerged as a very promising field which could be used for human motion detection and biomechanical systems, etc. Three-dimensional (3D) graphene foam (GF) has been reported before for high-performance strain sensors, however, some problems such as high cost preparation, low sensitivity, and stretchability still remain. In this paper, we report a highly stretchable and sensitive strain sensor based on 3D GF and polydimethylsiloxane (PDMS) composite. The GF is prepared by assembly process from graphene oxide via a facile and scalable method and possesses excellent mechanical property which facilitates the infiltration of PDMS prepolymer into the graphene framework. The as-prepared strain sensor can be stretched as high as 30% of its original length and the gauge factor of this sensor is as high as 98.66 under 5% of applied strain. Moreover, the strain sensor shows long-term stability in 200 cycles of stretching-relaxing. Implementation of the device for monitoring the bending of elbow and finger results in reproducibility and various responses in the form of resistance change. Thus, the developed strain sensors exhibit great application potential in fields of biomechanical systems and human-interactive applications.

High-Strength, Tough, Fatigue Resistant, and Self-Healing Hydrogel Based on Dual Physically Cross-Linked Network

Hydrogels usually suffer from low mechanical strength, which largely limit their application in many fields. In this Research Article, we prepared a dual physically cross-linked hydrogel composed of poly(acrylamide-co-acrylic acid) (PAM-co-PAA) and poly(vinyl alcohol) (PVA) by simple two-steps methods of copolymerization and freezing/thawing. The hydrogen bond-associated entanglement of copolymer chains formed as cross-linking points to construct the first network. After being subjected to the freezing/thawing treatment, PVA crystalline domains were formed to serve as knots of the second network. The hydrogels were demonstrated to integrate strength and toughness (1230 ± 90 kPa and 1250 ± 50 kJ/m(3)) by the introduction of second physically cross-linked network. What̀s more, the hydrogels exhibited rapid recovery, excellent fatigue resistance, and self-healing property. The dynamic property of the dual physically cross-linked network contributes to the excellent energy dissipation and self-healing property. Therefore, this work provides a new route to understand the toughness mechanism of dual physically cross-linked hydrogels, hopefully promoting current hydrogel research and expanding their applications.

Highly Thermally Conductive Composite Papers Prepared Based on the Thought of Bioinspired Engineering

The rapid development of modern electronics and three-dimensional integration sets stringent requirements for efficient heat removal of thermal-management materials to ensure the long lifetime of the electronics. However, conventional polymer composites that have been used widely as thermal-management materials suffer from undesired thermal conductivity lower than 10 W m(-1) K(-1). In this work, we report a novel thermally conductive composite paper based on the thought of bioinspired engineering. The advantage of the bioinspired papers over conventional composites lies in that they possess a very high in-plane thermal conductivity up to 21.7 W m(-1) K(-1) along with good mechanical properties and high electrical insulation. We attribute the high thermal conductivity to the improved interfacial interaction between assembled components through the introduction of silver nanoparticles and the oriented structure based on boron nitride nanosheets and silicon carbide nanowires. This thought based on bioinspired engineering provides a creative opportunity for design and fabrication of novel thermally conductive materials, and this kind of composite paper has potential applications in powerful integrated microelectronics.

A Combination of Boron Nitride Nanotubes and Cellulose Nanofibers for the Preparation of a Nanocomposite with High Thermal Conductivity

With the current development of modern electronics toward miniaturization, high-degree integration and multifunctionalization, considerable heat is accumulated, which results in the thermal failure or even explosion of modern electronics. The thermal conductivity of materials has thus attracted much attention in modern electronics. Although polymer composites with enhanced thermal conductivity are expected to address this issue, achieving higher thermal conductivity (above 10 W m-1 K-1) at filler loadings below 50.0 wt % remains challenging. Here, we report a nanocomposite consisting of boron nitride nanotubes and cellulose nanofibers that exhibits high thermal conductivity (21.39 W m-1 K-1) at 25.0 wt % boron nitride nanotubes. Such high thermal conductivity is attributed to the high intrinsic thermal conductivity of boron nitride nanotubes and cellulose nanofibers, the one-dimensional structure of boron nitride nanotubes, and the reduced interfacial thermal resistance due to the strong interaction between the boron nitride nanotubes and cellulose nanofibers. Using the as-prepared nanocomposite as a flexible printed circuit board, we demonstrate its potential usefulness in electronic device-cooling applications. This thermally conductive nanocomposite has promising applications in thermal interface materials, printed circuit boards or organic substrates in electronics and could supplement conventional polymer-based materials.

Polymer Composite with Improved Thermal Conductivity by Constructing a Hierarchically Ordered Three-Dimensional Interconnected Network of BN

In this work, we report a fabrication of epoxy resin/ordered three-dimensional boron nitride (3D-BN) network composites through combination of ice-templating self-assembly and infiltration methods. The polymer composites possess much higher thermal conductivity up to 4.42 W m-1 K-1 at relatively low loading 34 vol % than that of random distribution composites (1.81 W m-1 K-1 for epoxy/random 3D-BN composites, 1.16 W m-1 K-1 for epoxy/random BN composites) and exhibit a high glass transition temperature (178.9-229.2 °C) and dimensional stability (22.7 ppm/K). We attribute the increased thermal conductivity to the unique oriented 3D-BN thermally conducive network, in which the much higher thermal conductivity along the in-plane direction of BN microplatelets is most useful. This study paves the way for thermally conductive polymer composites used as thermal interface materials for next-generation electronic packaging and 3D integration circuits.

Boron nitride@graphene oxide hybrids for epoxy composites with enhanced thermal conductivity

Polymer-based materials have widely been used for electronics packaging owing to their excellent physical and chemical properties. However, polymer materials usually have low thermal conductivity, which thus may impair the performance and reliability of modern electronics. In this paper, we report an epoxy-based composite with increased thermal conductivity by using graphene oxide-encapsulated boron nitride (h-BN@GO) hybrids as fillers. The thermal conductivity of the obtained composites increased with the loading of h-BN@GO hybrids to a maximum of 2.23 W m−1 K−1 when the loading of h-BN@GO hybrids was 40 wt%, which is double that of composites filled with h-BN. This increase is attributed to the presence of GO, which improved the compatibility of h-BN with epoxy resin, along with the reduced interfacial thermal resistance between h-BN and epoxy resin. In addition, the effects of h-BN@GO hybrids on the thermal and dielectric properties of epoxy composites were also investigated. The prepared h-BN@GO/epoxy composites exhibit outstanding performance in dimensional stability, slightly reduced thermal stability, and enhanced dielectric properties, which make them suitable as excellent electronics packaging materials.