Yasuhiro Suga
Sony Broadcast & Professional Research Laboratories
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Publication
Featured researches published by Yasuhiro Suga.
electronic components and technology conference | 2009
Ryoji Kojima; Takashi Matsumura; Kazutaka Furuta; Kazunori Hamazaki; Junichi Nishimura; Yasuhiro Suga; Motohide Takeichi
Elasticity Bonding System (EBS) is newly developed flip chip bonding method using thermosetting film-shaped resin as adhesive and elastic body as bonding tool. Unlike conventional Anisotropic Conductive Film (ACF) and Non Conductive Film (NCF) method, EBS can bond multi-chip, passive and IC chips simultaneously, because elastic body absorbs their difference in height and inclination.
Archive | 2006
Takashi Matsumura; Hisashi Ando; Shiyuki Kanisawa; Yasuhiro Suga; Noriaki Kudo
Archive | 2000
Yasuhiro Suga; Motohide Takeichi
Archive | 2004
Takashi Matsumura; Hisashi Ando; Shiyuki Kanisawa; Yasuhiro Suga; Noriaki Kudo
Archive | 2002
Noriyuki Honda; Yasuhiro Suga
Archive | 2011
Takahiro Fujii; Yasuhiro Suga
Archive | 2009
Takashi Matsumura; Hisashi Ando; Shiyuki Kanisawa; Yasuhiro Suga; Noriaki Kudo
Archive | 1999
Tohru Terasaki; Noriyuki Honda; Seiichi Miyachi; Yasuhiro Suga
Archive | 2006
Takashi Ando; Shiko Kanisawa; Takashi Matsumura; Yasuhiro Suga; Kazuaki Suzuki; 尚 安藤; 士行 蟹澤; 和明 鈴木; 保博 須賀
Archive | 2012
Hideaki Okumiya; Yasuhiro Suga; Akifumi Higuchi; Yasumasa Shin; Takahiro Fujii
