Yasuo Kanetake

A study on packaging design of SiC power module using near-field magnetic scanning techniques

This report focuses the current distribution in a module identifiedwith magnetic near-field intensity for optimizing layout and packaging design of silicon carbide (SiC) power module. This measurement methodology can visualize the practical current distribution on a wiring pattern in a module and can estimate the effect of snubber capacitor in a DC-link of half-bridge to suppress the voltage overshoot and ringing oscillation.

A study on wiring pattern design for intelligent SiC power module with PEEC method

The fast switching operation of wide-bandgap power semiconductor devices deteriorates the Electromagnetic interference (EMI) noise characteristics of a power converter. The parasitic inductance in a power module is one cause of noise generator. This paper calculates parasitic inductance in a wiring pattern of module with Partial Element Equivalent Circuit (PEEC) method, and evaluates the current distribution in a module by magnetic near-field intensity measurement to discuss the suitable wiring pattern design for intelligent silicon carbide (SiC) power module.