Yingping Hong

A High Temperature Capacitive Pressure Sensor Based on Alumina Ceramic for in Situ Measurement at 600 °C

In response to the growing demand for in situ measurement of pressure in high-temperature environments, a high temperature capacitive pressure sensor is presented in this paper. A high-temperature ceramic material-alumina is used for the fabrication of the sensor, and the prototype sensor consists of an inductance, a variable capacitance, and a sealed cavity integrated in the alumina ceramic substrate using a thick-film integrated technology. The experimental results show that the proposed sensor has stability at 850 °C for more than 20 min. The characterization in high-temperature and pressure environments successfully demonstrated sensing capabilities for pressure from 1 to 5 bar up to 600 °C, limited by the sensor test setup. At 600 °C, the sensor achieves a linear characteristic response, and the repeatability error, hysteresis error and zero-point drift of the sensor are 8.3%, 5.05% and 1%, respectively.

Measurement of wireless pressure sensors fabricated in high temperature co-fired ceramic MEMS technology

High temperature co-fired ceramics (HTCCs) have wide applications with stable mechanical properties, but they have not yet been used to fabricate sensors. By introducing the wireless telemetric sensor system and ceramic structure embedding a pressure-deformable cavity, the designed sensors made from HTCC materials (zirconia and 96% alumina) are fabricated, and their capacities for the pressure measurement are tested using a wireless interrogation method. Using the fabricated sensor, a study is conducted to measure the atmospheric pressure in a sealed vessel. The experimental sensitivity of the device is 2 Hz/Pa of zirconia and 1.08 Hz/Pa of alumina below 0.5 MPa with a readout distance of 2.5 cm. The described sensor technology can be applied for monitoring of atmospheric pressure to evaluate important component parameters in harsh environments.

A High-Temperature Piezoresistive Pressure Sensor with an Integrated Signal-Conditioning Circuit

This paper focuses on the design and fabrication of a high-temperature piezoresistive pressure sensor with an integrated signal-conditioning circuit, which consists of an encapsulated pressure-sensitive chip, a temperature compensation circuit and a signal-conditioning circuit. A silicon on insulation (SOI) material and a standard MEMS process are used in the pressure-sensitive chip fabrication, and high-temperature electronic components are adopted in the temperature-compensation and signal-conditioning circuits. The entire pressure sensor achieves a hermetic seal and can be operated long-term in the range of −50 °C to 220 °C. Unlike traditional pressure sensor output voltage ranges (in the dozens to hundreds of millivolts), the output voltage of this sensor is from 0 V to 5 V, which can significantly improve the signal-to-noise ratio and measurement accuracy in practical applications of long-term transmission based on experimental verification. Furthermore, because this flexible sensor’s output voltage is adjustable, general follow-up pressure transmitter devices for voltage converters need not be used, which greatly reduces the cost of the test system. Thus, the proposed high-temperature piezoresistive pressure sensor with an integrated signal-conditioning circuit is expected to be highly applicable to pressure measurements in harsh environments.

Phase Interrogation Used for a Wireless Passive Pressure Sensor in an 800 °C High-Temperature Environment

A wireless passive pressure measurement system for an 800 °C high-temperature environment is proposed and the impedance variation caused by the mutual coupling between a read antenna and a LC resonant sensor is analyzed. The system consists of a ceramic-based LC resonant sensor, a readout device for impedance phase interrogation, heat insulating material, and a composite temperature-pressure test platform. Performances of the pressure sensor are measured by the measurement system sufficiently, including pressure sensitivity at room temperature, zero drift from room temperature to 800 °C, and the pressure sensitivity under the 800 °C high temperature environment. The results show that the linearity of sensor is 0.93%, the repeatability is 6.6%, the hysteretic error is 1.67%, and the sensor sensitivity is 374 KHz/bar. The proposed measurement system, with high engineering value, demonstrates good pressure sensing performance in a high temperature environment.

Low-Cost Wireless Temperature Measurement: Design, Manufacture, and Testing of a PCB-Based Wireless Passive Temperature Sensor

Low-cost wireless temperature measurement has significant value in the food industry, logistics, agriculture, portable medical equipment, intelligent wireless health monitoring, and many areas in everyday life. A wireless passive temperature sensor based on PCB (Printed Circuit Board) materials is reported in this paper. The advantages of the sensor include simple mechanical structure, convenient processing, low-cost, and easiness in integration. The temperature-sensitive structure of the sensor is a dielectric-loaded resonant cavity, consisting of the PCB substrate. The sensitive structure also integrates a patch antenna for the transmission of temperature signals. The temperature sensing mechanism of the sensor is the dielectric constant of the PCB substrate changes with temperature, which causes the resonant frequency variation of the resonator. Then the temperature can be measured by detecting the changes in the sensor’s working frequency. The PCB-based wireless passive temperature sensor prototype is prepared through theoretical design, parameter analysis, software simulation, and experimental testing. The high- and low-temperature sensing performance of the sensor is tested, respectively. The resonant frequency decreases from 2.434 GHz to 2.379 GHz as the temperature increases from −40 °C to 125 °C. The fitting curve proves that the experimental data have good linearity. Three repetitive tests proved that the sensor possess well repeatability. The average sensitivity is 347.45 KHz/°C℃ from repetitive measurements conducted three times. This study demonstrates the feasibility of the PCB-based wireless passive sensor, which provides a low-cost temperature sensing solution for everyday life, modern agriculture, thriving intelligent health devices, and so on, and also enriches PCB product lines and applications.

A noncontact wireless passive radio frequency (RF) resonant pressure sensor with optimized design for applications in high-temperature environments

A noncontact wireless passive pressure sensor based on alumina ceramic for pressure measurement is presented in this paper. A faithful pressure signal in harsh environment is captured through wireless sensing, and a novel antenna design method is developed to increase the measurement distance between the antenna and the sensor. The sensor is fabricated using a novel no-co-fired technology, and the properties of the alumina ceramic and platinum ensure the feasibility of the sensor in high-temperature environments. The experimental results show that the coupled distance between the antenna and the sensor can be up to 5.5 cm, and the designed sensor, featuring improved structural parameters, has a high responsivity (15.5 kHz kPa−1) in a pressure environment at room temperature. The sensor can be coupled with the antenna at 850 °C, which verifies the feasibility in high-temperature environments.

Passive Resistor Temperature Compensation for a High-Temperature Piezoresistive Pressure Sensor

The main limitation of high-temperature piezoresistive pressure sensors is the variation of output voltage with operating temperature, which seriously reduces their measurement accuracy. This paper presents a passive resistor temperature compensation technique whose parameters are calculated using differential equations. Unlike traditional experiential arithmetic, the differential equations are independent of the parameter deviation among the piezoresistors of the microelectromechanical pressure sensor and the residual stress caused by the fabrication process or a mismatch in the thermal expansion coefficients. The differential equations are solved using calibration data from uncompensated high-temperature piezoresistive pressure sensors. Tests conducted on the calibrated equipment at various temperatures and pressures show that the passive resistor temperature compensation produces a remarkable effect. Additionally, a high-temperature signal-conditioning circuit is used to improve the output sensitivity of the sensor, which can be reduced by the temperature compensation. Compared to traditional experiential arithmetic, the proposed passive resistor temperature compensation technique exhibits less temperature drift and is expected to be highly applicable for pressure measurements in harsh environments with large temperature variations.

A Distance Compensated Approach Used in Wireless Passive Pressure Sensor Readout System for High Temperature Application

This paper proposed a distance compensated measurement system for a wireless passive sensor based on the high temperature cofired ceramics (HTCC) applied to high temperature environment. The sensor model is provided and fabricated. Also, a telemetric measurement system consists of a readout instrumentation and a heat insulation unit is described due to the thickness of heat insulation material between the sensor and readout unit’s inductance coils in high temperature testing environment. Consideration of the leakage inductance and parasitic parameters which depend on the coupling distance is equivalent to the thickness of heat insulation material, and a distance compensated method is presented. The compensation is based on the mathematical feature of the testing results from readout unit which show us information about the relation between the extracted resonant frequencies. This method can be used simply and reliably in the other telemetric mutual inductance coupling readout system as a viable solution to compensate the coupling distance related error when inductive coupling is varied. It has been experimentally tested, and the results are in good agreement with those measured by a reference impedance analysis instrument. Theoretical explanations, experimental results, and discussion are reported.

Interface Characteristics of Sapphire Direct Bonding for High-Temperature Applications

In this letter, we present a sapphire direct bonding method using plasma surface activation, hydrophilic pre-bonding, and high temperature annealing. Through the combination of sapphire inductively coupled plasma etching and the direct bonding process, a vacuum-sealed cavity employable for high temperature applications is achieved. Cross-sectional scanning electron microscopy (SEM) research of the bonding interface indicates that the two sapphire pieces are well bonded and the cavity structure stays intact. Moreover, the tensile testing shows that the bonding strength of the bonding interface is in excess of 7.2 MPa. The advantage of sapphire direct bonding is that it is free from the various problems caused by the mismatch in the coefficients of thermal expansion between different materials. Therefore, the bonded vacuum-sealed cavity can be potentially further developed into an all-sapphire pressure sensor for high temperature applications.

AlN-Based Ceramic Patch Antenna-Type Wireless Passive High-Temperature Sensor

An aluminum nitride (AlN) based patch antenna-type high-temperature wireless passive sensor is reported to operate as both a sensor and an antenna, which integrates in situ measurement/sensing with remote wireless communication at the same time. The sensor is small, easy to manufacture, highly sensitive and has a high operating temperature; it can be used in high-temperature, chemically corrosive and other harsh environments. The sensing mechanism of the sensor, the dielectric constant of the AlN ceramic substrate, increases with rising temperature, which reduces the resonant frequency of the sensor. Thus, the temperature can be measured by detecting changes in the sensor’s resonant frequency. High-Frequency Simulation Structure (HFSS) software is used to determine the structure and size of the sensor, which is then fabricated using thick-film technology. The substrate of the sensor is AlN ceramic due to its outstanding thermal resistance at high temperature; and its conductors (the radiation patch and the ground under the substrate) are silver-palladium alloy sintered form silver–palladium paste. A vector network analyzer reveals that the sensor’s operating range extends to 700 °C. Furthermore, its resonant frequency decreases from 2.20 GHz to 2.13 GHz with increasing temperature from room temperature (25 °C) to 700 °C, with an absolute sensitivity of 104.77 KHz/°C. Our work verifies the feasibility of measuring high temperatures using AlN-based patch antenna wireless passive temperature sensors, and provides a new material and temperature sensitive structure for high-temperature measurement in harsh environments.