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Featured researches published by Yinon Degani.


international solid-state circuits conference | 1998

Silicon-on-silicon integration of a GSM transceiver with VCO resonator

P. Davis; P. Smith; E. Campbell; Jenshan Lin; K. Gross; G. Bath; Y. Low; M.Y. Lau; Yinon Degani; J.A. Gregus; R.C. Frye; King Lien Tai

Accurate and spurious-free design of an integrated VCO resonator in a GSM transceiver is demonstrated. The high-Q inductor (Q=60 at 1 GHz) in the resonator is on a high-resistivity silicon substrate and the GSM chip is flip-chip mounted on the same substrate. The VCO meets all GSM requirements: phase noise is-142 dBc/Hz at 10 MHz from the 1018 MHz center frequency. A single bipolar chip contains the RF transmit, receive, and synthesizer subsections for the GSM standard. The addition of an external low-noise amplifier, power amplifier, and filters complete the GSM radio section. A number of inductors and capacitors are integrated onto the chip. Many of the passive components needed to operate the transceiver, however, are poor candidates for on-chip integration either because their values are too large or because they have stringent quality factor (Q) requirements.


Journal of the American Chemical Society | 1988

Direct electrical communication between chemically modified enzymes and metal electrodes. 2. Methods for bonding electron-transfer relays to glucose oxidase and D-amino-acid oxidase

Yinon Degani; Adam Heller


Archive | 1995

Packaging multi-chip modules without wire-bond interconnection

Yinon Degani; Thomas Dixon Dudderar; Byung Joon Han; Alan Michael Lyons; King Lien Tai


Archive | 1996

Thin packaging of multi-chip modules with enhanced thermal/power management

Yinon Degani; Thomas Dixon Dudderar; Byung Joon Han; Alan Michael Lyons


Archive | 2001

Stacked module package

Yinon Degani; Thomas Dixon Dudderar; Liguo Sun; Meng Zhao


Archive | 1998

Solder bonding printed circuit boards

Yinon Degani; King Lien Tai


Archive | 1997

RF IC package

Yinon Degani; Peter R Smith; King Lien Tai


Archive | 2001

Packaging micromechanical devices

Yinon Degani; Thomas Dixon Dudderar; King Lien Tai


Archive | 1998

Recessed flip-chip package

Yinon Degani; Robert Charles Frye; Yee Leng Low


Archive | 1998

Flip chip metallization

Yinon Degani; Jeffrey A. Gregus

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