Yoshihiro Tomita

Molded chip scale package for high pin count

A unique molded chip scale package (CSP) associated 1024 pin counts has been developed. This package has the bare die soldering feature, that means highest mount density and enhanced electrical characteristic, and the robust package feature, that means easy to handle, to test and to standardize such as known good die (KGD). The wiring conductor patterns made of copper realized enhanced electrical characteristic. The solder bumping process with screen printing technique, was applied with cost competitiveness. And the transfer molding process produced high reliable package.

Thermally enhanced flip-chip BGA with organic substrate

A thermally enhanced Flip-chip BGA package (FC-BGA) with organic substrate has been developed. The package is proud of the high thermal and electrical performance due to the flip-chip interconnections, and the optimized heat spreader attached directly on to the die. Besides, the eutectic solder bumps (Pb63wt% Sn) have realized high reliability of flip-chip interconnections, compared with the high melting point solder bumps (Pb-3wt% Sn connected with Pb-63wt% Sn).

Flip-chip BGA applied high-density organic substrate

In the area of high-end logic devices, high pin counts, high speed and high thermal dissipation are strongly required for packages. A Flip-Chip BGA (FC-BGA) has been developed for such requirements. The FC-BGA has successfully realized up to 1681 pin counts and lower crosstalk noise, by using a high-density organic substrate with the 30 /spl mu/m/30 /spl mu/m line and spacing width rule and optimizing the substrate layer structure. Furthermore, in order to realize a highly reliable package, the Under Bump Metal (UBM) made of Ni/Cu/Ti for eutectic solder bump was developed and the flux-less bonding process was introduced. The FC-BGA packages applied high-density organic substrate has been developed for leading edge logic devices of networking and computing systems.