Naoto Ueda

Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame

Method of making a lead on chip (LOC) semiconductor device

Method of die bonding semiconductor chip

Method of making leadframe for lead-on-chip (LOC) semiconductor device

Semiconductor module with mounting region for semiconductor element

Plastics encapsulated semiconductor device - has resin-filled space above element and under parallel plane in which internal wiring is arranged in proximity to surface electrode connections

Semiconductor device with lead-on-chip-structure - has brazing solder material with no moisture absorption, formed on surface of semiconductor component and fixed to support plate

Joining material, joining method and semiconductor equipment

Semiconductor device package forming process

Halbleitervorrichtung mit LOC-Leiterrahmen und Verfahren zu ihrer Herstellung A semiconductor device having the LOC lead frame and methods for their preparation