Yuki Masuda
Toray Industries
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Publication
Featured researches published by Yuki Masuda.
cpmt symposium japan | 2013
Osamu Baba; Satoshi Kamemoto; Yuki Masuda; Tomoyuki Yuba; Masao Tomikawa
We found that positive-tone photosensitive polyimide (posi-PSPI) shows not to be compatible for electroless Ni/Au plating process which are used for Au micro bumping. In order to meet compatibility for the process, we improved chemical resistance of positive-tone photosensitive polyimide especially for electroless plating process. Changing of polyimide polymer structure is most effective to obtain chemical resistant for the electroless plating process. The obtained PSPI are useful for saving bumping process and reliable in forming pattern.
electronic components and technology conference | 2016
Yu Shoji; Yuki Masuda; Keika Hashimoto; Kimio Isobe; Yutaro Koyama; Ryoji Okuda
Journal of Photopolymer Science and Technology | 2016
Yu Shoji; Yutaro Koyama; Yuki Masuda; Keika Hashimoto; Kimio Isobe; Ryoji Okuda
Archive | 2013
Hiroyuki Onishi; Yuki Masuda; Masao Tomikawa
Archive | 2013
Hiroyuki Onishi; Yuki Masuda; Masao Tomikawa
Archive | 2012
Yumiko Okuda; 裕美子 奥田; Yuki Masuda; 有希 増田; Masao Tomikawa; 真佐夫 富川
international conference on electronics packaging | 2018
Masao Tomikawa; Yuki Masuda; Yu Shoji; Kazuyuki Matsumura; Ryoji Okuda
Journal of Photopolymer Science and Technology | 2018
Yuki Masuda; Keika Hashimoto; Yu Shoji; Yutaro Koyama; Masao Tomikawa
2018 Pan Pacific Microelectronics Symposium (Pan Pacific) | 2018
Masao Tomikawa; Yuki Masuda; Yu Shoji; Kazuyuki Matsumura; Ryoji Okuda
electronics packaging technology conference | 2017
Takenori Fujiwara; Yu Shoji; Yuki Masuda; Keika Hashimoto; Yutaro Koyama; Kimio Isobe; Hitoshi Araki; Ryoji Okuda; Masao Tomikawa
