Yukio Maehashi

Embedded SRAM and Cortex-M0 core with backup circuits using a 60-nm crystalline oxide semiconductor for power gating

A chip of embedded SRAM having backup circuits using a 60-nm c-axis aligned crystalline oxide semiconductor (CAAC-OS) such as CAAC indium-gallium-zinc oxide (CAAC-IGZO) and Cortex-M0 core having flip-flops with CAAC-OS backup circuits is fabricated. The SRAM and M0 core can retain data using the backup circuits during power-off; thus, they can perform power gating (PG) with backup time of 100 ns and recovery time of 10 clock cycles (including data restoration time (100 ns)). Further, memory cell area and performance in combining a 45-nm Si SRAM memory cell with 60-nm CAAC-OS are estimated to have negligible overhead.

Embedded SRAM and Cortex-M0 Core Using a 60-nm Crystalline Oxide Semiconductor

Using data retention circuits that include crystalline oxide semiconductor transistors as backup circuits for power gating, a processor system can reduce standby leakage current significantly. This is effective in the Internet of Things (IoT) applications that require standby power reduction. The crystalline oxide semiconductor transistor can constitute a nonvolatile data retention circuit easily because it exhibits significantly lower off-state current than a silicon transistor and is highly compatible with a CMOS logic circuit. The backup circuit can achieve 2-clock-cycle data backup and 4-clock-cycle data restore; thus, the processor system can efficiently perform temporally fine-grained power gating and can achieve longer standby times. Furthermore, area overheads due to the backup circuits are kept very small because the crystalline oxide semiconductor transistors are stacked on silicon transistors.

A normally-off microcontroller unit with an 85% power overhead reduction based on crystalline indium gallium zinc oxide field effect transistors

A low-power normally-off microcontroller unit (NMCU) having state-retention flip-flops (SRFFs) using a c-axis aligned crystalline oxide semiconductor (CAAC-OS) such as indium gallium zinc oxide (IGZO) transistors and employing a distributed backup and recovery method (distributed method) is fabricated. Compared to an NMCU employing a centralized backup and recovery method (centralized method), the NMCU employing the distributed method can be powered off approximately 75 µs earlier after main processing and can start the main processing approximately 75 µs earlier after power-on. The NMCU employing the distributed method can reduce power overhead by approximately 85% and power consumption by approximately 18% compared to the NMCU employing the centralized method. The NMCU employing the distributed method can retain data even when it is powered off, can back up data at high speed, and can start effective processing immediately after power-on. The NMCU could be applied to a low-power MCU.

Embedded SRAM and Cortex-M0 Core with Backup Circuits using a 60-nm Crystalline Oxide Semiconductor for Power Gating

Using data retention circuits that include crystalline oxide semiconductor transistors as backup circuits for power gating, a processor system can reduce standby leakage current significantly. This is effective in the Internet of Things (IoT) applications that require standby power reduction. The crystalline oxide semiconductor transistor can constitute a nonvolatile data retention circuit easily because it exhibits significantly lower off-state current than a silicon transistor and is highly compatible with a CMOS logic circuit. The backup circuit can achieve 2-clock-cycle data backup and 4-clock-cycle data restore; thus, the processor system can efficiently perform temporally fine-grained power gating and can achieve longer standby times. Furthermore, area overheads due to the backup circuits are kept very small because the crystalline oxide semiconductor transistors are stacked on silicon transistors.