Yun-Ho Chung

Wafer Level Integrated Antenna Front End Module For Low Cost Phased Array Implementation

This paper describes the implementation of a fully integrated antenna front-end that leverages Northrop Grumman Space Technologys (NGSTs) novel wafer level packaging technique to marry the optimal technology per function through the bonding of III-V wafers. To demonstrate the proposed approach, a 4-element Q-band linear array has been assembled and tested to validate the concept.

High performance voltage controlled bi-directional amplifiers in support of component reuse for large aperture phase array

The objective of this paper is to provide a novel and innovative solution to reduce the projected high parts count for large aperture phase array (>100,000 elements). Bi-directional amplifiers are ideal for this application since RF amplification, in either transmit or receive directions, are controlled through bias thus eliminating the need for lossy switches that degrades the system noise figure performance, In addition, the size, weight, and cost of the transceiver module can be greatly reduced since only one amplifier is required Two bidirectional amplifiers are presented here in both common. gate and common-source configurations.

A compact transceiver for wide bandwidth and high power K-, Ka-, and V-band applications

Using the state-of-the-art InP MMICs and advanced packaging techniques, we demonstrated a compact transceiver with wide bandwidth (13% to 54%) and high power (over 500 mW) in covering K-, Ka and V-band operating frequencies. This module consists of over 30 MMICs and over 200 components and is considered to be the most complex module reported in the millimeter-wave frequencies. This work has laid a good foundation for combining MMIC and packaging technologies for a versatile millimeter-wave transceiver module.

Ultra compact, light weight T/R modules constructed by hermetic wafer-level packaging technology

System requirements are becoming more demanding and this trend is likely to continue. Future systems will need to meet more stringent requirements, such as larger bandwidth, faster system response, higher frequency of operation, better SWAP (Size, Weight and Power), it will also need to be realized in the field with these improvements in a timely matter. Integrated multi-function front end modules have been demonstrated using Northrop Grumman Corporations (NGC) Wafer-Scale Assembly (WSA) technology. WSA is an enabling technology capable of constructing ultra compact, ultra light weight front end modules for large array systems. In this paper, WSA advantages and system considerations are discussed. Demonstration of WSA circuits and results are presented.