Yutaka Higashiguchi
Fujitsu
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Publication
Featured researches published by Yutaka Higashiguchi.
Microelectronics Reliability | 2002
Kinuko Mishiro; Shigeo Ishikawa; Mitsunori Abe; Toshio Kumai; Yutaka Higashiguchi; Kenichiro Tsubone
Abstract In this study, ball grid arrays (BGAs) and chip size packages (CSPs) were evaluated with respect to their solder joint reliabilities under drop impacts. The correlation between solder joint stresses and motherboard strains was confirmed by numerical analysis, and the motherboard strains caused by the drop impacts were measured to evaluate the BGA/CSP reliability. The authors found that the stress at a solder joint differs depending on the package structure, even if the motherboard strain is the same, and that underfilling eases the motherboard strain and disperses the stress concentrated on a solder joint.
Archive | 2017
Yutaka Higashiguchi; Mitsuo Inagaki; Makoto Totani; Yasuhiro Teshima; Hiroshi Iimura
Archive | 1996
Yutaka Higashiguchi; Toshio Kumai; Yasuhiro Teshima; Mamoru Niishiro; Yasushi Kobayashi; Yukio Sekiya; Shuzo Igarashi; Yasuhiro Ichihara
Archive | 1996
Yutaka Higashiguchi; Mitsuo Inagaki; Toshio Kumai; Ryoichi Ochiai; Yasuhiro Teshima; Mamoru Niishiro; Yasushi Kobayashi; Hideaki Tamura; Hiroshi Iimura; Seishi Chiba; Yukio Sekiya; Shuzo Igarashi; Yasuhiro Ichihara
Archive | 1996
Yutaka Higashiguchi; Mitsuo Inagaki; Toshio Kumai; Ryoichi Ochiai; Makoto Totani
Archive | 1997
Yutaka Higashiguchi
Archive | 1995
Yutaka Higashiguchi; Mitsuo Inagaki; Takeyasu Maeda; Kazuyoshi Aoki; Kohichi Kamei; Toshiaki Amano
Archive | 2007
Kinuko Mishiro; Yutaka Higashiguchi; Masahiko Yamashita
Archive | 1995
Yutaka Higashiguchi; Masao Hosogai; Hiroyuki Otaguro; Hitoshi Yokemura; Masaharu Hida
Archive | 1993
Yutaka Higashiguchi; Mitsuo Inagaki; Hidenori Tanizawa; Takeyasu Maeda; Noriyuki Kohma; Hajime Mochizuki; Kouroh Mekata; Toshiaki Amano; Yoshikazu Kamei
