Toshio Kumai
Fujitsu
Network
Latest external collaboration on country level. Dive into details by clicking on the dots.
Publication
Featured researches published by Toshio Kumai.
Microelectronics Reliability | 2002
Kinuko Mishiro; Shigeo Ishikawa; Mitsunori Abe; Toshio Kumai; Yutaka Higashiguchi; Kenichiro Tsubone
Abstract In this study, ball grid arrays (BGAs) and chip size packages (CSPs) were evaluated with respect to their solder joint reliabilities under drop impacts. The correlation between solder joint stresses and motherboard strains was confirmed by numerical analysis, and the motherboard strains caused by the drop impacts were measured to evaluate the BGA/CSP reliability. The authors found that the stress at a solder joint differs depending on the package structure, even if the motherboard strain is the same, and that underfilling eases the motherboard strain and disperses the stress concentrated on a solder joint.
Archive | 1996
Yutaka Higashiguchi; Toshio Kumai; Yasuhiro Teshima; Mamoru Niishiro; Yasushi Kobayashi; Yukio Sekiya; Shuzo Igarashi; Yasuhiro Ichihara
Archive | 1996
Yutaka Higashiguchi; Mitsuo Inagaki; Toshio Kumai; Ryoichi Ochiai; Yasuhiro Teshima; Mamoru Niishiro; Yasushi Kobayashi; Hideaki Tamura; Hiroshi Iimura; Seishi Chiba; Yukio Sekiya; Shuzo Igarashi; Yasuhiro Ichihara
Archive | 1996
Yutaka Higashiguchi; Mitsuo Inagaki; Toshio Kumai; Ryoichi Ochiai; Makoto Totani
Archive | 1992
Toshio Kumai; Takaki Kokubun; Shingo Nojiri
Archive | 2002
Jiyoushi Goto; Toshio Kumai; Tatsuya Okuno; Kenichiro Tsubone; 健一郎 坪根; 辰弥 奥野; 錠志 後藤; 利夫 熊井
Archive | 1991
Toshio Kumai; Takaki Kokubun; Shingo Nojiri
Archive | 2010
Toshio Kumai
Archive | 2002
Toshio Kumai; Hisamitsu Takagi; 利夫 熊井; 久光 高木
Archive | 2008
Toshio Kumai; 利夫 熊井
