Yutaka Shimazaki

Development of a Resinoid Diamond Wire Containing Metal Powder for Slicing a Slicing Ingot

Abstract Loose-abrasive wire sawing widely employed for slicing silicon ingots has problems of dirty working environment and inefficiency. Fixed-abrasive wires, namely electroplated diamond wires and resinoid diamond wires, have been developed to overcome these problems. Resinoid diamond wires, which can be produced at a lower cost, can be put to practical use, but they have a low breaking twist strength. In this study, metal powder is added to the resinoid bond to strengthen it. A series of experiments revealed that the breaking twist strength, heat resistance, tool wear resistance, and slicing efficiency of this wire are significantly improved.

Improvement of form accuracy in axisymmetrical grinding by considering the form generation mechanism

Abstract Countermeasures are proposed to overcome the problem that, in grinding an axisymmetrical surface, the surface profile concavely deviates from the ideal profile. By experimentally investigating the form generation mechanism, it was found that the grindability deteriorated on the outward surface owing to direct contact between the wheel bond and the workpiece. Using a hard bonded wheel improved form accuracy, and traversing the wheel outward from the workpiece center achieved both high form accuracy of less than 120 nm p-v and good roughness ranging from 20 to 40 nm Ry.

Study on Precision Grinding of Axisymmetrical Form. Mechanism of Form Generation.

In grinding of axisymmetrical surfaces, residual removal increases in peripheral region. Therefore, the surface profile becomes concave and the form accuracy deteriorates. In this paper, the mechanism of generating axisymmetrical form error is made clear by analyzing the change of grinding force. The following facts are revealed by experiments. (1) In case of traversing of a wheel from outer to inner, enormous normal grinding force in the periphery results in large residual removal. (2) Increase in the normal grinding force is considered to be the result from direct contact of bond and workpiece in grinding process. (3) By traversing of a wheel from inner to outer, the form error reduces less than 120 nm p-p.