Z. Gu

Photoluminescence properties of AlN homoepilayers with different orientations

AlN homoepilayers and heteroepilayers were grown on polar c-plane and nonpolar a-plane and m-plane orientations of AlN bulk and sapphire substrates by metal organic chemical vapor deposition. A systematic comparative study of photoluminescence properties of these samples revealed that all AlN homoepilayers (c, a and m planes) were strain free with an identical band gap of about 6.099 (6.035)eV at 10 (300)K, which is about 42meV below the band gap of c-plane AlN heteroepilayers grown on sapphire. Also, nonpolar a-plane homoepilayers have the highest emission intensity over all other types of epilayers. We believe that a-plane AlN homoepilayers have the potential to provide orders of magnitude improvement in the performance of new generation deep UV photonic devices.

The Durability of Various Crucible Materials for Aluminum Nitride Crystal Growth by Sublimation

Producing high purity aluminum nitride crystals by the sublimation-recondensation technique is difficult due to the inherently reactive crystal growth environment, normally at temperature in excess of 2100 °C. The durability of the furnace fixture materials (crucibles, retorts, etc.) at such a high temperature remains a critical problem. In the present study, the suitability of several refractory materials for AlN crystal growth is investigated, including tantalum carbide, niobium carbide, tungsten, graphite, and hot-pressed boron nitride. The thermal and chemical properties and performance of these materials in inert gas, as well as under AlN crystal growth conditions are discussed. TaC and NbC are the most stable crucible materials with very low elemental vapor pressures in the crystal growth system. Compared with refractory material coated graphite crucibles, HPBN crucible is better for AlN self-seeded growth, as crystals tend to nucleate in thin colorless platelets with low dislocation density.

Sublimation Growth of Aluminum Nitride-Silicon Carbide Alloy Crystals on SiC (0001) Substrates

Thick (up to 1 mm) AlN-SiC alloy crystals were grown on off-axis Si-face 6H-SiC (0001) substrates by the sublimation-recondensation method from a mixture of AlN and SiC powders at 1860-1990 °C in a N2 atmosphere. The color of the crystals changed from clear to dark green with increasing growth temperature. Raman spectroscopy and x-ray diffraction (XRD) confirmed an AlN-SiC alloy was formed with the wurtzite structure and good homogeneity. Three broad peaks were detected in the Raman spectra, with one of those related to an AlN-like and another one to a SiC-like mode, both shifted relative to their usual positions in the binary compounds, and the third broad peak with possible contributions from both AlN and SiC. Scanning Auger microanalysis (SAM) and electron probe microanalysis (EPMA) demonstrated the alloy crystals had an approximate composition of (AlN)0.75(SiC)0.25 with a stoichiometric ratio of Al:N and Si:C. The substrate misorientation ensured a two-dimensional growth mode confirmed by scanning electron microscopy (SEM).

Oxidation of Aluminum Nitride for Defect Characterization

The thermal oxidation of aluminum nitride was developed as a means to study defects in bulk aluminum nitride crystals. The oxidation kinetics was established for the dry oxidation of highly textured AlN polycrystals produced by sublimation-recombination crystal growth in a tungsten furnace. Despite seeding on polycrystalline tungsten, the grains were predominantly [0001] oriented as verified by electron backscattering diffraction (EBSD). The oxidation rate is dependent on the crystal’s orientation, polarity, stress, and surface condition, thus oxidation decorates grain boundaries, polishing scratches, and inversion domains by producing oxide layers of different thicknesses. Low temperature (800 °C) dry oxidation produced an amorphous oxide layer and generated a high density of defects (vacancies, stacking faults, and dislocations) in the nitride near the oxide/nitride interface, as observed by cross-sectional transmission electron microscopy. In contrast, high temperature oxidation (1000 °C) produced a crystalline oxide layer, and left the nitride free of observable defects.