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Zafer S. Kutlu

LSI Corporation

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Publication

Featured researches published by Zafer S. Kutlu.

Archive | 1998

Thermally-enhanced flip chip IC package with extruded heatspreader

Atila Mertol; Zeki Z. Celik; Farshad Ghahghahi; Zafer S. Kutlu

Archive | 2002

Enhanced laminate flipchip package using a high CTE heatspreader

Zafer S. Kutlu

Archive | 2000

Integrated circuit package having a stiffener dimensioned to receive heat transferred laterally from the integrated circuit

Zafer S. Kutlu

Archive | 2003

Thermal and mechanical attachment of a heatspreader to a flip-chip integrated circuit structure using underfill

Ivor G. Barber; Zafer S. Kutlu

Archive | 2008

Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive

Zeki Z. Celik; Zafer S. Kutlu; Vishal Shah

Archive | 2006

Embedded strain gauge in printed circuit boards

Zafer S. Kutlu

Archive | 2003

Low stress flip-chip package for low-K silicon technology

Kumar Nagarajan; Zafer S. Kutlu

Archive | 2000

Balanced coefficient of thermal expansion for flip chip ball grid array

Kumar Nagarajan; Zafer S. Kutlu; Shirish Shah

Archive | 2007

INTEGRATED CIRCUIT PACKAGE WITH SOLDERED LID FOR IMPROVED THERMAL PERFORMANCE

Zafer S. Kutlu

Archive | 2005

Zero ATE insertion force interposer daughter card

Carlo Grilletto; Zafer S. Kutlu

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Kumar Nagarajan

LSI Corporation

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Zeki Z. Celik

LSI Corporation

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Shirish Shah

LSI Corporation

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Vishal Shah

LSI Corporation

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Anand Govind

LSI Corporation

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Farshad Ghahghahi

LSI Corporation

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Aritharan Thurairajaratnam

LSI Corporation

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Atila Mertol

LSI Corporation

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Carlo Grilletto

LSI Corporation

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Chaowen Chung

LSI Corporation

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