A. A. Allerman

InGaAsN solar cells with 1.0 eV band gap, lattice matched to GaAs

The design, growth by metal-organic chemical vapor deposition, and processing of an In{sub 0.07}Ga{sub 0.93}As{sub 0.98}N{sub 0.02} solar Al, with 1.0 ev bandgap, lattice matched to GaAs is described. The hole diffusion length in annealed, n-type InGaAsN is 0.6-0.8 pm, and solar cell internal quantum efficiencies > 70% arc obwined. Optical studies indicate that defects or impurities, from InGAsN doping and nitrogen incorporation, limit solar cell performance.

Effect of threading dislocations on the Bragg peakwidths of GaN, AlGaN, and AlN heterolayers

We develop a reciprocal-space model that describes the (hkl) dependence of the broadened Bragg peakwidths produced by x-ray diffraction from a dislocated epilayer. We compare the model to experiments and find that it accurately describes the peakwidths of 16 different Bragg reflections in the [010] zone of both GaN and AlN heterolayers. Using lattice-distortion parameters determined by fitting the model to selected reflections, we estimate threading-dislocation densities for seven different GaN and AlGaN samples and find improved agreement with transmission electron microscopy measurements.

Junction and carrier temperature measurements in deep-ultraviolet light-emitting diodes using three different methods

The junction temperature of AlGaN ultraviolet light-emitting diodes emitting at 295nm is measured by using the temperature coefficients of the diode forward voltage and emission peak energy. The high-energy slope of the spectrum is explored to measure the carrier temperature. A linear relation between junction temperature and current is found. Analysis of the experimental methods reveals that the diode-forward voltage is the most accurate (±3°C). A theoretical model for the dependence of the diode forward voltage (Vf) on junction temperature (Tj) is developed that takes into account the temperature dependence of the energy gap. A thermal resistance of 87.6K∕W is obtained with the device mounted with thermal paste on a heat sink.

Room-temperature direct current operation of 290 nm light-emitting diodes with milliwatt power levels

Ultraviolet light-emitting diodes (LEDs) have been grown by metalorganic vapor phase epitaxy using AlN nucleation layers and thick n-type Al0.48Ga0.52N current spreading layers. The active region is composed of three Al0.36Ga0.64N quantum wells with Al0.48Ga0.52N barriers for emission at 290 nm. Devices were designed as bottom emitters and flip-chip bonded to thermally conductive submounts using an interdigitated contact geometry. The ratio of quantum well emission to 330 nm sub-band gap emission is as high as 125:1 for these LEDs. Output power as high as 1.34 mW at 300 mA under direct current operation has been demonstrated with a forward voltage of 9.4 V. A peak external quantum efficiency of 0.18% has been measured at an operating current of 55 mA.

Improved brightness of 380 nm GaN light emitting diodes through intentional delay of the nucleation island coalescence

Ultraviolet light emitting diodes (LEDs) have been grown using metalorganic vapor phase epitaxy, while monitoring the 550 nm reflected light intensity. During nucleation of GaN on sapphire, the transition from three-dimensional (3D) grain growth to two-dimensional (2D) coalesced growth was intentionally delayed in time by lowering the NH3 flow during the initial high temperature growth. Initially, when the reflectance signal is near zero, the GaN film is rough and composed of partly coalesced 3D grains. Eventually, the reflected light intensity recovers as the 2D morphology evolves. For 380 nm LEDs grown on 3D nucleation layers, we observe increased light output. For LEDs fabricated on GaN films with a longer recovery time an output power of 1.3 mW at 20 mA current was achieved.

Single-transverse-mode vertical-cavity lasers under continuous and pulsed operation

Using a hybrid ion implanted/selectively oxidized device structure, we report high-power single-mode operation of an 850-nm vertical-cavity laser. Under continuous-wave operation, >4 mW of single-mode power with 45 dB of side-mode suppression is achieved. The spectral behavior under pulsed modulation is determined to be influenced by thermal lensing. When biased to threshold, single-mode operation with >35-dB side-mode suppression is obtained for large signal modulation.

InAsSb‐based mid‐infrared lasers (3.8–3.9 μm) and light‐emitting diodes with AlAsSb claddings and semimetal electron injection, grown by metalorganic chemical vapor deposition

Gain‐guided, injection lasers using AlAsSb for optical confinement and a strained InAsSb/InAs multiquantum well active region were grown by metalorganic chemical vapor deposition. The semi‐metal properties of a p‐GaAsSb/n‐InAs heterojunction are utilized as a source for injection of electrons into the active region of the laser. In pulsed mode, the laser operated up to 210 K with an emission wavelength of 3.8–3.9 μm. We also report on the two‐color emission of a light‐emitting diode with two different active regions to demonstrate multistage operation of these ‘‘unipolar ’’ devices.

Minority carrier diffusion and defects in InGaAsN grown by molecular beam epitaxy

To gain insight into the nitrogen-related defects of InGaAsN, nitrogen vibrational mode spectra, Hall mobilities, and minority carrier diffusion lengths are examined for InGaAsN (1.1 eV band gap) grown by molecular beam epitaxy (MBE). Annealing promotes the formation of In–N bonding, and lateral carrier transport is limited by large scale (≫mean free path) material inhomogeneities. Comparing solar cell quantum efficiencies with our earlier results for devices grown by metalorganic chemical vapor deposition (MOCVD), we find significant electron diffusion in the MBE material (reversed from the hole diffusion in MOCVD material), and minority carrier diffusion in InGaAsN cannot be explained by a “universal,” nitrogen-related defect.

Self-heating study of an AlGaN∕GaN-based heterostructure field-effect transistor using ultraviolet micro-Raman scattering

We report micro-Raman studies of self-heating in an AlGaN∕GaN heterostructure field-effect transistor using below (visible 488.0nm) and near (UV 363.8nm) GaN band-gap excitation. The shallow penetration depth of the UV light allows us to measure temperature rise (ΔT) in the two-dimensional electron gas (2DEG) region of the device between drain and source. Visible light gives the average ΔT in the GaN layer, and that of the SiC substrate, at the same lateral position. Combined, we depth profile the self-heating. Measured ΔT in the 2DEG is consistently over twice the average GaN-layer value. Electrical and thermal transport properties are simulated. We identify a hotspot, located at the gate edge in the 2DEG, as the prevailing factor in the self-heating.

Time-resolved photoluminescence studies of InxGa1−xAs1−yNy

Time-resolved photoluminescence spectroscopy has been used to investigate carrier decay dynamics in a InxGa1−xAs1−yNy (x∼0.03, y∼0.01) epilayer grown on GaAs by metal organic chemical vapor deposition. Time-resolved photoluminescence (PL) measurements, performed for various excitation intensities and sample temperatures, indicate that the broad PL emission at low temperature is dominated by localized exciton recombination. Lifetimes in the range of 0.07–0.34 ns are measured; these photoluminescence lifetimes are significantly shorter than corresponding values obtained for GaAs. In particular, we observe an emission energy dependence of the decay lifetime at 10 K, whereby the lifetime decreases with increasing emission energy across the PL spectrum. This behavior is characteristic of a distribution of localized states, which arises from alloy fluctuations.Time-resolved photoluminescence spectroscopy has been used to investigate carrier decay dynamics in a In{sub x}Ga{sub 1{minus}x}As{sub 1{minus}y}N{sub y} (x {approximately} 0.03, y {approximately} 0.01) epilayer grown on GaAs by metal organic chemical vapor deposition. Time-resolved photoluminescence (PL) measurements, performed for various excitation intensities and sample temperatures, indicate that the broad PL emission at low temperature is dominated by localized exciton recombination. Lifetimes in the range of 0.07--0.34 ns are measured; these photoluminescence lifetimes are significantly shorter than corresponding values obtained for GaAs. In particular, the authors observe an emission energy dependence of the decay lifetime at 10 K, whereby the lifetime decreases with increasing emission energy across the PL spectrum. This behavior is characteristic of a distribution of localized states, which arises from alloy fluctuations.