A. Emadi

Design and implementation of a sub-nm resolution microspectrometer based on a Linear-Variable Optical Filter

In this paper the concept of a microspectrometer based on a Linear Variable Optical Filter (LVOF) for operation in the visible spectrum is presented and used in two different designs: the first is for the narrow spectral band between 610 nm and 680 nm, whereas the other is for the wider spectral band between 570 nm and 740 nm. Design considerations, fabrication and measurement results of the LVOF are presented. An iterative signal processing algorithm based on an initial calibration has been implemented to enhance the spectral resolution. Experimental validation is based on the spectrum of a Neon lamp. The results of measurements have been used to analyze the operating limits of the concept and to explain the sources of error in the algorithm. It is shown that the main benefits of a LVOF-based microspectrometer are in case of implementation in a narrowband application. The realized LVOF microspectrometers show a spectral resolution of 2.2 nm in the wideband design and 0.7 nm in the narrowband design.

Vertically tapered layers for optical applications fabricated using resist reflow

This paper reports on the IC-compatible fabrication of vertically tapered optical layers for use in linear variable optical filters (LVOF). The taper angle is fully defined by a mask design. Only one masked lithography step is required for defining strips in a photoresist with trenches etched therein of a density varying along the length of the strip. In a subsequent reflow, this patterned photoresist is planarized, resulting in a strip with a local thickness defined by the initial layer thickness and the trench density at that position before reflow. Hence a taper can be flexibly programmed by the mask design to be from 0.001o to 0.1o, which enables the simultaneous fabrication of tapered layers of different taper angles. The 3D pattern of resist structures is subsequently transferred into Si or SiO2 by appropriate etching. Complete LVOF fabrication involves CMOS-compatible deposition of a lower dielectric mirror using a stack of dielectrics on the wafer, tapered layer formation and deposition of the top dielectric mirror. Design principle, processing and simulation results plus experimental validation of the technique on the profile in the resist and after transfer of the taper into Si and SiO2 are presented.

A thermopile detector array with scaled TE elements for use in an integrated IR microspectrometer

The design and fabrication of a thermopile detector array for use in a fully integrated infrared optical spectrometer are described. IC-compatible MEMS technologies are used for fabrication of the spectrometer components, such as the slit, planar imaging diffraction grating and detector array. The IR micro-spectrometer was designed for operation in the 1.5‐3 µm wavelength range with the size of the largest dimension about 8 mm. The imaging properties of the diffraction grating result in non-uniform dispersion, which imposes special requirements on the dimensions of each single detector in the array. The result is an array of unequally sized elements. The design considers technological constraints, sensitivity and cross-talk between elements. Simulation results, final design, fabrication technique and fabricated devices are presented. (Some figures in this article are in colour only in the electronic version)

Characterization of thermal cross-talk in a MEMS-based thermopile detector array

The spectral resolution of a MEMS-based IR microspectrometer critically depends on the thermal cross-talk between adjacent TE elements in the detector array. Thermal isolation between elements is realized by using bulk micromachining directly following CMOS processing. This paper reports on the characterization results of bridge-shaped TE detector elements that are cut out of a membrane. Elements with dimensions of 650 × 36 ?m2 are separated by 10 ?m wide gaps in order to minimize the thermal cross-talk by heat conduction through the support structure. The static and dynamic aspects of thermal cross-talk have been evaluated with an emphasis on the effect of the thermal conductivity of air as a function of the package pressure.

Design, fabrication and characterization of infrared LVOFs for measuring gas composition

This paper presents the design, fabrication and characterization of a linear-variable optical-filter (LVOF) that will be used in a micro-spectrometer operating in infrared (IR) for natural gas composition measurement. An LVOF is placed on top of an array of detectors and transforms the optical spectrum into a lateral intensity profile, which is recorded by the detectors. The IR LVOF was fabricated in an IC-compatible process using a photoresist reflow technique, followed by transfer etching of the photoresist into the optical resonator layer. The spectral range between 3 to 5 mu m contains the absorption peaks for hydrocarbons, carbon-monoxide and carbon-dioxide. The resulting optical absorption is utilized to measure the gas concentrations in a sample volume. Two LVOF structures were designed and fabricated on silicon wafers using alternate layers of sputtered silicon and silicon-dioxide as the high- and low- refractive index materials. These filters consist of a Fabry-Perot resonator combined with a band-pass filter designed to block out-of-band transmissions. Finally, the filters were fully characterized with an FTIR spectrometer and showed satisfactory agreement with the optical thin-film simulations. The characterization showed a spectral resolution of 100 nm, which can be further improved with signal processing algorithms. This method makes it possible to fabricate small and robust LVOFs with high resolving power in the IR spectral range directly on the detector array chip.

Linear variable optical filter-based ultraviolet microspectrometer

An IC-compatible linear variable optical filter (LVOF) for application in the UV spectral range between 310 and 400 nm has been fabricated using resist reflow and an optimized dry-etching. The LVOF is mounted on the top of a commercially available CMOS camera to result in a UV microspectrometer. A special calibration technique has been employed that is based on an initial spectral measurement on a xenon lamp. The image recorded on the camera during calibration is used in a signal processing algorithm to reconstruct the spectrum of the mercury lamp and the calibration data is subsequently used in UV spectral measurements. Experiments on a fabricated LVOF-based microspectrometer with this calibration approach implemented reveal a spectral resolution of 0.5 nm.

High-resolution microspectrometer with an aberration-correcting planar grating

A concept for a highly miniaturized spectrometer featuring a two-component design is presented. The first component is a planar chip that integrates an input slit and aberration-correcting diffraction grating with an image sensor and is fabricated using microelectromechanical systems (MEMS) technologies. Due to the fabrication in a simple MEMS batch process the essential elements of the spectrometer are automatically aligned, and a low fabrication cost per device can be achieved. The second component is a spherical mirror, which is the only external part. The optimized grating structure compensates for aberrations within the spectrometer operating range, resulting in a diffraction-limited performance of the spectrometer optics. The prototype of the device has been fabricated and characterized. It takes a volume of 0.5 cm(3) and provides a FWHM spectral resolution of 0.7 nm over a 350 nm bandwidth from 420 nm to 770 nm combined with an etendue of 7.4x10(-5) mm(2) sr.

Optimal implementation of a microspectrometer based on a single flat diffraction grating

An analytical model has been developed and applied to explore the limits in the design of a highly miniaturized planar optical microspectrometer based on an imaging diffraction grating. This design tool has been validated as providing the smallest possible dimensions while maintaining acceptable spectral resolution. The resulting planar spectrometer is composed of two parallel glass plates, which contain all components of the device, including a reflective slit and an imaging diffraction grating. Fabrication is based on microelectromechanical system technology and starts with a single glass wafer; IC-compatible deposition and lithography are applied to realize the parts in aluminum, which makes the microspectrometer highly tolerant for component mismatch. The fabricated spectrometer was mounted directly on top of an image sensor and takes up a volume of only 50 mm(3). The measured spectral resolution of 6 nm (FWHM) in the 100 nm operating wavelength range (600-700 nm) is in agreement with a model calculation.

A surface micromachined thermopile detector array with an interference-based absorber

A thermo-electric (TE) infrared detector array composed of 23 thermopiles, each with 5 thermocouples on a suspended beam of 650 × 36 µm2 dimensions, has been fabricated in a CMOS-compatible MEMS process. The array is used for realization of an IR micro-spectrometer in the 1–5 µm spectral range. Interference filter-based IR absorbers using titanium/aluminum layers with a silicon carbide cavity layer have been designed, fabricated and validated. These thin film stacks are more suitable for the subsequent processes as compared to conventional techniques. The silicon carbide layer is also used for device protection. The TE detector with an interference filter-based absorber features a sensitivity of 294 V W−1 in the 2.15 µm wavelength range and a thermal time constant of 4.85 ms in vacuum.

Spectral measurement using IC-compatible linear variable optical filter

This paper reports on the functional and spectral characterization of a microspectrometer based on a CMOS detector array covered by an IC-Compatible Linear Variable Optical Filter (LVOF). The Fabry-Perot LVOF is composed of 15 dielectric layers with a tapered middle cavity layer, which has been fabricated in an IC-Compatible process using resist reflow. A pattern of trenches is made in a resist layer by lithography and followed by a reflow step result in a smooth tapered resist layer. The lithography mask with the required pattern is designed by a simple geometrical model and FEM simulation of reflow process. The topography of the tapered resist layer is transferred into silicon dioxide layer by an optimized RIE process. The IC-compatible fabrication technique of such a LVOF, makes fabrication directly on a CMOS or CCD detector possible and would allow for high volume production of chip-size micro-spectrometers. The LVOF is designed to cover the 580 nm to 720 spectral range. The dimensions of the fabricated LVOF are 5×5 mm2. The LVOF is placed in front of detector chip of a commercial camera to enable characterization. An initial calibration is performed by projecting monochromatic light in the wavelength range of 580 nm to 720 nm on the LVOF and the camera. The wavelength of the monochromatic light is swept in 1 nm steps. The Illuminated stripe region on the camera detector moves as the wavelength is swept. Afterwards, a Neon lamp is used to validate the possibility of spectral measurement. The light from a Neon lamp is collimated and projected on the LVOF on the camera chip. After data acquisition a special algorithm is used to extract the spectrum of the Neon lamp.