S. Grabarnik
Delft University of Technology
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Featured researches published by S. Grabarnik.
Optics Express | 2007
S. Grabarnik; Arwin Emadi; Mikhail Loktev; Elena Sokolova; Gleb Vdovin
We report on a miniature spectrometer with a volume of 0.135 cm(3) and dimensions of 3x3x11 mm, mounted directly on the surface of a CCD sensor. The spectrometer is formed by two flat diffraction gratings that are designed to perform both the dispersion and imaging functions, eliminating the need for any spherical optics. Two separate parts of the device were fabricated with the single-mask 1 mum lithography on a single glass wafer. The wafer was diced and the device was assembled and directly mounted onto a CCD sensor. The resolution of 3 nm, spectral range of 450 to 750 nm and the optical throughput of ~9% were measured to be in a complete agreement with the model used for the development of the device.
Journal of Micromechanics and Microengineering | 2009
A. Emadi; H. Wu; S. Grabarnik; G. de Graaf
This paper reports on the IC-compatible fabrication of vertically tapered optical layers for use in linear variable optical filters (LVOF). The taper angle is fully defined by a mask design. Only one masked lithography step is required for defining strips in a photoresist with trenches etched therein of a density varying along the length of the strip. In a subsequent reflow, this patterned photoresist is planarized, resulting in a strip with a local thickness defined by the initial layer thickness and the trench density at that position before reflow. Hence a taper can be flexibly programmed by the mask design to be from 0.001o to 0.1o, which enables the simultaneous fabrication of tapered layers of different taper angles. The 3D pattern of resist structures is subsequently transferred into Si or SiO2 by appropriate etching. Complete LVOF fabrication involves CMOS-compatible deposition of a lower dielectric mirror using a stack of dielectrics on the wafer, tapered layer formation and deposition of the top dielectric mirror. Design principle, processing and simulation results plus experimental validation of the technique on the profile in the resist and after transfer of the taper into Si and SiO2 are presented.
Journal of Micromechanics and Microengineering | 2008
H. Wu; S. Grabarnik; A. Emadi; G. de Graaf
The design and fabrication of a thermopile detector array for use in a fully integrated infrared optical spectrometer are described. IC-compatible MEMS technologies are used for fabrication of the spectrometer components, such as the slit, planar imaging diffraction grating and detector array. The IR micro-spectrometer was designed for operation in the 1.5‐3 µm wavelength range with the size of the largest dimension about 8 mm. The imaging properties of the diffraction grating result in non-uniform dispersion, which imposes special requirements on the dimensions of each single detector in the array. The result is an array of unequally sized elements. The design considers technological constraints, sensitivity and cross-talk between elements. Simulation results, final design, fabrication technique and fabricated devices are presented. (Some figures in this article are in colour only in the electronic version)
Journal of Micromechanics and Microengineering | 2009
H. Wu; S. Grabarnik; A. Emadi; G. de Graaf
The spectral resolution of a MEMS-based IR microspectrometer critically depends on the thermal cross-talk between adjacent TE elements in the detector array. Thermal isolation between elements is realized by using bulk micromachining directly following CMOS processing. This paper reports on the characterization results of bridge-shaped TE detector elements that are cut out of a membrane. Elements with dimensions of 650 × 36 ?m2 are separated by 10 ?m wide gaps in order to minimize the thermal cross-talk by heat conduction through the support structure. The static and dynamic aspects of thermal cross-talk have been evaluated with an emphasis on the effect of the thermal conductivity of air as a function of the package pressure.
Applied Optics | 2008
S. Grabarnik; A. Emadi; H. Wu; Ger de Graaf
A concept for a highly miniaturized spectrometer featuring a two-component design is presented. The first component is a planar chip that integrates an input slit and aberration-correcting diffraction grating with an image sensor and is fabricated using microelectromechanical systems (MEMS) technologies. Due to the fabrication in a simple MEMS batch process the essential elements of the spectrometer are automatically aligned, and a low fabrication cost per device can be achieved. The second component is a spherical mirror, which is the only external part. The optimized grating structure compensates for aberrations within the spectrometer operating range, resulting in a diffraction-limited performance of the spectrometer optics. The prototype of the device has been fabricated and characterized. It takes a volume of 0.5 cm(3) and provides a FWHM spectral resolution of 0.7 nm over a 350 nm bandwidth from 420 nm to 770 nm combined with an etendue of 7.4x10(-5) mm(2) sr.
Applied Optics | 2008
S. Grabarnik; A. Emadi; Elena Sokolova; Gleb Vdovin
An analytical model has been developed and applied to explore the limits in the design of a highly miniaturized planar optical microspectrometer based on an imaging diffraction grating. This design tool has been validated as providing the smallest possible dimensions while maintaining acceptable spectral resolution. The resulting planar spectrometer is composed of two parallel glass plates, which contain all components of the device, including a reflective slit and an imaging diffraction grating. Fabrication is based on microelectromechanical system technology and starts with a single glass wafer; IC-compatible deposition and lithography are applied to realize the parts in aluminum, which makes the microspectrometer highly tolerant for component mismatch. The fabricated spectrometer was mounted directly on top of an image sensor and takes up a volume of only 50 mm(3). The measured spectral resolution of 6 nm (FWHM) in the 100 nm operating wavelength range (600-700 nm) is in agreement with a model calculation.
Proceedings of SPIE | 2010
A. Emadi; S. Grabarnik; H. Wu; Ger de Graaf; Karin Hedsten; Peter Enoksson; J. H. Correia
This paper reports on the functional and spectral characterization of a microspectrometer based on a CMOS detector array covered by an IC-Compatible Linear Variable Optical Filter (LVOF). The Fabry-Perot LVOF is composed of 15 dielectric layers with a tapered middle cavity layer, which has been fabricated in an IC-Compatible process using resist reflow. A pattern of trenches is made in a resist layer by lithography and followed by a reflow step result in a smooth tapered resist layer. The lithography mask with the required pattern is designed by a simple geometrical model and FEM simulation of reflow process. The topography of the tapered resist layer is transferred into silicon dioxide layer by an optimized RIE process. The IC-compatible fabrication technique of such a LVOF, makes fabrication directly on a CMOS or CCD detector possible and would allow for high volume production of chip-size micro-spectrometers. The LVOF is designed to cover the 580 nm to 720 spectral range. The dimensions of the fabricated LVOF are 5×5 mm2. The LVOF is placed in front of detector chip of a commercial camera to enable characterization. An initial calibration is performed by projecting monochromatic light in the wavelength range of 580 nm to 720 nm on the LVOF and the camera. The wavelength of the monochromatic light is swept in 1 nm steps. The Illuminated stripe region on the camera detector moves as the wavelength is swept. Afterwards, a Neon lamp is used to validate the possibility of spectral measurement. The light from a Neon lamp is collimated and projected on the LVOF on the camera chip. After data acquisition a special algorithm is used to extract the spectrum of the Neon lamp.
Optics Express | 2007
Aleksey Nikolaevich Simonov; S. Grabarnik; G.V Vdovine
We have investigated the possibility of using transparent stretchable diffraction gratings for spectrometric applications. The gratings were fabricated by replication of a triangular-groove master into a transparent viscoelastic. The sample length, and hence the spatial period, can be reversibly changed by mechanical stretching. When used in a monochromator with two slits, the stretchable grating permits scanning the spectral components over the output slit, converting the monochromator into a scanning spectrometer. The spectral resolution of such a spectrometer was found to be limited mainly by the wave-front aberrations due to the grating deformation. A model relating the deformation-induced aberrations in different diffraction orders is presented. In the experiments, a 12-mm long viscoelastic grating with a spatial frequency of 600 line pairs/mm provided a full-width at half-maximum resolution of up to ~1.2 nm in the 580-680 nm spectral range when slowly stretched by a micrometer screw and ~3 nm when repeatedly stretched by a voice coil at 15 Hz. Comparison of aberrations in transmitted and diffracted beams measured by a Shack- Hartmann wave-front sensor showed that astigmatisms caused by stretch-dependent wedge deformation are the main factors limiting the resolution of the viscoelastic-grating-based spectrometer.
Proceedings of SPIE, the International Society for Optical Engineering | 2008
S. Grabarnik; A. Emadi; H. Wu; G. de Graaf; Gleb Vdovin
The design and performance of a highly miniaturized spectrometer fabricated using MEMS technologies are reported in this paper. Operation is based on an imaging diffraction grating. Minimizing fabrication complexity and assembly of the micromachined optical and electronic parts of the microspectrometer implies a planar design. It consists of two parallel glass plates, which contain all spectrograph components, including slit and diffraction grating, and can be fabricated on a single glass wafer with standard lithography. A simple analytical model for determining spectral resolution from device dimensions was developed and used for finding the optimal parameters of a miniaturized spectrometer as a compromise between size and spectral resolution. The fabricated spectrometer is very compact (11 × 1.5 × 3 mm3), which allowed mounting directly on top of an image sensor. The realized spectrometer features a 6 nm spectral resolution over a 100 nm operating range from 600 nm to 700 nm, which was tested using a Ne light source.
Journal of Micromechanics and Microengineering | 2008
S. Grabarnik; A. Emadi; H. Wu; G. de Graaf; Gleb Vdovin
The design, fabrication and performance of a highly miniaturized optical spectrometer are described. The volume of the opto-electronic system is only 50 mm3. The main components are a planar imaging diffraction grating and a commercially available CCD camera. System integration is based on MEMS technologies on a glass wafer. The imaging grating circumvents the need for collimating optics, while the planar grating design is essential for limiting fabrication complexity and enabling assembly of the optical and electronic parts. The system consists of two glass plates placed in parallel with well-defined spacing and comprises all spectrometer components including slit and diffraction grating. The glass plates were fabricated using a single glass wafer with standard lithography applied. The spectrometer demonstrated a 6 nm FWHM spectral resolution in an operating range from 600 nm to 700 nm.