A. Sutono

High-Q LTCC-based passive library for wireless system-on-package (SOP) module development

In this paper, we present the development and full characterization and modeling of a multilayer ceramic-based system-on-package component library. Compact high-Q three-dimensional inductor and capacitor topologies have been chosen and incorporated. A measured inductor Q factor as high as 100 and self-resonant frequency as high as 8 GHz have been demonstrated. The new vertically interdigitated capacitor topology occupies nearly an order of magnitude less of real estate while demonstrating comparable performance to the conventional topology. The low-temperature co-fired ceramic (LTCC) library has been incorporated into a 1.9-GHz CMOS power-amplifier design exhibiting a measured 17-dB gain, 26-dBm output power, and 48% power added efficiency. This power-amplifier module with fully integrated LTCC passives demonstrates a superior performance to those with full and partial on-chip passive integration.

A compact LTCC-based Ku-band transmitter module

Presents design, implementation, and measurement of a three-dimensional (3-D)-deployed RF front-end system-on-package (SOP) in a standard multi-layer low temperature co-fired ceramic (LTCC) technology. A compact 14 GHz GaAs MESFET-based transmitter module integrated with an embedded bandpass filter was built on LTCC 951AT tapes. The up-converter MMIC integrated with a voltage controlled oscillator (VCO) exhibits a measured up-conversion gain of 15 dB and an IIP3 of 15 dBm, while the power amplifier (PA) MMIC shows a measured gain of 31 dB and a 1-dB compression output power of 26 dBm at 14 GHz. Both MMICs were integrated on a compact LTCC module where an embedded front-end band pass filter (BPF) with a measured insertion loss of 3 dB at 14.25 GHz was integrated. The transmitter module is compact in size (400 /spl times/ 310 /spl times/ 35.2 mil/sup 3/), however it demonstrated an overall up-conversion gain of 41 dB, and available data rate of 32 Mbps with adjacent channel power ratio (ACPR) of 42 dB. These results suggest the feasibility of building highly SOP integrated RF front ends for microwave and millimeter wave applications.

Experimental modeling, repeatability investigation and optimization of microwave bond wire interconnects

We present the first comprehensive experimental characterization of bond wire interconnects at microwave frequencies which includes a repeatability study, modeling and optimization. Wire bond interconnects with two different bond types (ball-crescent and wedge), two different loop types (tight and loose) and two different lengths (15 and 25 mils), were fabricated and experimentally investigated. We report the performance and repeatability comparison of these configurations and develop an electromagnetic as well as a simple wide band lumped-element equivalent circuit model to 40 GHz. A novel ribbon bond interconnect topology has also been proposed and experimentally tested demonstrating 65% less reflection compared to the conventional bond wire or ribbon configuration.

Development of three dimensional ceramic-based MCM inductors for hybrid RF/microwave applications

We present the design, development and characterization of planar and multilayer (3-D) inductor structures fabricated on a multi-layer ceramic-based Multi-Chip-Module (MCM-C) technology. We experimentally demonstrate the feasibility of utilizing both planar and compact 3-D helical inductors for hybrid RF and microwave system implementation. For the same numbers of turns and dimensions as the conventional planar inductor, the 3-D helical inductors occupies significantly less area and demonstrate better quality (Q) factor, higher inductance and comparable self resonant frequency (SRF).

A highly integrated transceiver module for 5.8 GHz OFDM communication system using multi-layer packaging technology

A highly integrated transceiver module for 5.8 GHz OFDM communication system is presented. The antenna and filter are directly fabricated on the module using multi-layer packaging technology in order to reduce size and interconnection losses. A cavity backed patch antenna with a vertical feed and an embedded 3D filter have been designed and integrated on the package using a low-temperature cofired ceramic (LTCC) process. RF functional blocks including PA, LNA, mixers and VCO are developed using GaAs-based MMICs and are attached on the surface of the LTCC board. RF blocks are vertically stacked and connected through via structures. The specifications of the functional blocks have been determined and verified through system simulations based on the IEEE 802.11a standard. The total size of the module is 14/spl times/19/spl times/2 mm/sup 3/. Measurement and simulation results of the components and the module are also presented.

RF power amplifier integration in CMOS technology

This paper explores different levels of integration for CMOS RF power amplifiers, including integration fully on chip, integration with LTCC passive components, and integration with off-chip components. At 1.9 GHz, the fully on-chip integrated CMOS PA can deliver 20 dBm output power with 16% efficiency. Because the LTCC inductors have much higher Q than the on-chip inductors, the CMOS PA integrated with passive components embedded in LTCC can improve the output power and efficiency to 24 dBm and 32% at 1.9 GHz, respectively. The 2.4 GHz Bluetooth PA with discrete passive components for output matching exhibits 22 dBm output power and 44% efficiency. To our knowledge, this paper reports the first development of fully on-chip integrated and LTCC hybrid CMOS power amplifiers.

Development of integrated three dimensional Bluetooth image reject filter

We present the design and implementation of an S-band compact planar integrated filter integrated in a multi-layer ceramic substrate. The center frequency of the 3.8 mm/spl times/2.4 mm/spl times/0.5 mm front end image reject filter is 2.4 GHz, suitable for use in a Bluetooth wireless LAN transceiver system. Measurement results shows 3 dB insertion loss and 22 dB return loss at the center frequency.

Design of miniature multilayer on-package integrated image-reject filters

We present the design, implementation, and characterization of compact on-package integrated multilayer image-reject filters. The filter implemented in a novel lumped-element stripline configuration in a standard low-temperature cofired ceramic technology occupies an area of only 3.8 mm /spl times/ 2.4 mm /spl times/ 0.5 mm. A distinct feature of this filter is the optimal use of the parasitics of the lumped-element components to implement other components as an integral part of the filter by novel vertical deployments of planar structures. Measurement data of the prototype indicate 3 dB of insertion loss and 20 dB of return loss at the center frequency of 2.4 GHz, as well as 39-dB attenuation at the image frequency, suitable for Bluetooth applications. This paper demonstrates the feasibility of on-package integration of RF front-end elements where the transceiver module is built and, therefore, significantly reduces the development cost.

Development of integrated 3D radio front-end system-on-package (SOP)

This paper presents the development and characterization of compact and highly integrated microwave and millimeter wave radio front-end Systems-on-Package (SOP). The three-dimensional transceiver front-end SOP architectures incorporate on-package integrated lumped element passives as well as RF functions primarily filters, baluns, and antennas in standard multi-layer LTCC and fully-organic technologies. An LTCC-based 14 GHz transmitter for satellite outdoor unit, an OC-192 transmitter incorporating Ku-band Optical Sub-Carrier Multiplexing (OSCM) technique as well fully-organic SOP transmission lines and lumped-element components have been demonstrated. These prototypes suggest the feasibility of developing highly miniaturized cost-effective SOP transceivers applicable not only for wireless but also for optoelectronics links.

A 2.4 GHz high efficiency SiGe HBT power amplifier with high-Q LTCC harmonic suppression filter

We present a 2.4 GHz SiGe HBT power amplifier integrated with a harmonic suppression filter implemented in a high-Q multilayer low-temperature cofired ceramic (LTCC) substrate at the output. The power amplifier delivers a power of up to 27.5 dBm with a maximum power-added efficiency (PAE) of 47%. It has a power output of 27 dBm at an input power of 0 dBm with a PAE of 45%. The second and third harmonics are -44 dBc and -49 dBc, respectively, at this operating point. The power amplifier exhibits a linear gain of 35 dB and operates at a supply voltage of 3.3 V. To the best of our knowledge, this represents the best reported performance of a SiGe HBT power amplifier at 2.4 GHz and is comparable to performance previously achieved only with GaAs-based processes. The harmonic suppression filter and output match network have been implemented completely in LTCC without the use of external discrete components.