Ajey M. Joshi

Selective plasma etching of silicon nitride in presence of silicon or silicon oxides using mixture of (CH3F or CH2F2) and CF4 and O2

Self-aligned contact etch with high sensitivity to nitride shoulder

Impedance-matching network

Method of controlling silicon-containing polymer build up during etching by using a periodic cleaning step

HALOGEN-FREE AMORPHOUS CARBON MASK ETCH HAVING HIGH SELECTIVITY TO PHOTORESIST

THREE-DIMENSIONAL (3D) PROCESSING AND PRINTING WITH PLASMA SOURCES

Apparatus for material spray deposition of high solid percentage slurries for battery active material manufacture applications

Method of controlling sidewall profile by using intermittent, periodic introduction of cleaning species into the main plasma etching species

Stabilizing an opened carbon hardmask

High efficiency impedance matching network